A production process for an electroformed stencil

Abstract

A production process for an electroformed stencil. The process flow is as follows: electroforming a first electroformed layer: core mold treatment -> pre-treatment (degreasing, pickling and sandblasting 1) -> film mounting 1 -> exposure 1 -> single sided developing 1 -> electroforming 1-> film stripping -> mold stripping; and electroforming up steps on a printing surface: printing surface pre-treatment (pickling and sandblasting 2) -> film mounting 2 -> exposure 2 -> single sided developing sided 2 -> electroforming 2 -> film stripping. By using the process, the electroformed stencil having an up step area on the printing surface, wherein the up step area has an opening pattern, can be produced. The stencil has the following advantages: deposition thickness uniformity COV of the stencil is 10% or less; the stencil surface has good quality, grade-one surface brightness, no pinholes or pitting; the binding strength between the up step area and the first electroformed layer is large, without the proneness of falling off; and the position precision of the pattern opening area of the up steps with the opening area of the first electroformed layer is high.

Description

[0001] technical field [0002] The invention relates to a manufacturing process of a stepped electroforming template, which belongs to the field of material manufacturing and processing, in particular to a printing surface in the field of PCB manufacturing with raised steps (up steps), and the raised step (up step) area has openings The manufacturing process of the mask plate for graphic printing. [0003] Background technique [0004] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The procurement of templates is not only the first step...

AI Technical Summary

Problems solved by technology

For the technology of local thickening, the key point is that the opening position of the up step graphic area and the opening position of the substrate graphic area should be high, and the auxiliary shunt plate used for the up step graphic area to share the current, and the bonding force should be large at the same time, otherwise the service life will greatly reduce

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