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Hybrid solder ball arrangement and method of forming same

A technology of mixed soldering and soldering balls, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., and can solve problems such as poor reliability, poor thermal cycle reliability, and different solder reliability

Active Publication Date: 2016-07-13
SAMSUNG SEMICON CHINA RES & DEV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, with solder balls containing different components, the reliability of the solder joint is not the same
For example, if the silver content in the solder is high, the reliability of the soldering is better in a thermal cycle (Thermalcycle) environment, but the reliability of the drop (Drop) is poor.
If the silver content is lower, the opposite is true, the drop reliability is better, and the thermal cycle reliability is worse
Therefore, it is difficult for electronic products in the prior art to ensure good reliability under different environments

Method used

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  • Hybrid solder ball arrangement and method of forming same
  • Hybrid solder ball arrangement and method of forming same
  • Hybrid solder ball arrangement and method of forming same

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Embodiment Construction

[0020] The invention will be described in more detail below with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. However, those skilled in the art should understand that these examples are provided in an illustrative sense only and should not be construed as limiting the scope of the present invention. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0021] figure 1 is a schematic diagram showing a mixed ball arrangement according to the first exemplary embodiment of the present invention. refer to figure 1 , the mixed solder ball arrangement according to the first exemplary embodiment of the present invention includes a plurality of solder balls formed on a plurality of electrical connectors, wherein the plurality of solder balls includes two or more different solder balls . Although in figure 1 Th...

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Abstract

The invention discloses a mixed solder ball arrangement and a forming method thereof, the mixed solder ball arrangement includes a plurality of solder balls formed on a plurality of electrical connectors, wherein the plurality of solder balls include two or two above the different solder balls. The mixed solder ball arrangement according to the present invention has high soldering reliability.

Description

technical field [0001] The present invention relates to a mixed solder ball arrangement and a method for forming the same, and more particularly, to a mixed solder ball arrangement with high soldering reliability and a method for forming the same. Background technique [0002] During the packaging and assembly process of electronic products, it is usually necessary to connect through solder. For example, commonly used chip bonding methods generally include, for example, flip chip bonding (flipchip) from a chip to a printed circuit board, SMT from a BGA package product to a circuit board, and the like. [0003] In the process of connecting the device to the circuit board, it is usually necessary to form solder balls (solder balls) on the device pads by electroplating or ball planting, and then realize interconnection with the circuit board through the solder balls. All solder balls used for the same type of interconnect on the same device typically use only one composition. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L24/14H01L2224/14H01L2224/14152H01L2224/14505H01L2924/00012
Inventor 鲁凯刘海
Owner SAMSUNG SEMICON CHINA RES & DEV