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touch device

A touch device and frame technology, which is applied in the fields of instruments, electrical digital data processing, and data processing input/output processes, etc., can solve problems such as defective products, broken glass substrates, and increased FPC, so as to improve product yield, The effect of high product yield and simple process

Active Publication Date: 2016-09-14
INTERFACE TECH CHENGDU CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, setting the ground conductive sheet on the FPC will increase the area of ​​the FPC, and when the ground conductive sheet is close to the edge of the sensing electrode, it is easy to cause the glass substrate where the sensing electrode is located to break or the ground conductive sheet is cut by the glass substrate. exist
In addition, the ACF bonding process is relatively complicated, and the position of the grounding conductive sheet is not easy to fix, resulting in defective products

Method used

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Embodiment Construction

[0043] Please also refer to figure 1 , figure 2 and image 3 . figure 1 A three-dimensional exploded schematic view of the touch device of the present invention. figure 2 Schematic diagram of the assembly of the touch device of the present invention. image 3 for figure 2 Schematic diagram of the section along line III-III. The touch device 1 includes a display module 10 , a touch module 30 and a conductive layer 50 .

[0044] The display module 10 includes a first frame 11 , a display panel 12 , a backlight module 13 , a circuit board 14 and a second frame 15 . The first frame 11 is a hollow frame, and cooperates with the second frame 15 to form a receiving space for receiving the display panel 12 , the backlight module 13 and the circuit board 14 . In this embodiment, the first frame 11 is a metal frame, the conductive structure 111 is a metal sheet, and the conductive structure 111 extends inward from the side wall of the first frame 11 adjacent to the light-emitt...

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Abstract

The invention relates to a touch device. The touch device comprises a display module, and the display module comprises a display panel, a circuit board, a first frame and a touch module. The circuit board is electrically connected with the display panel to be used for driving the display panel. The first frame accommodates the circuit board and the display panel, the first frame is provided with a partial conducting structure, and the conducting structure is electrically connected with the circuit board and is grounded through the circuit board. The touch module comprises a sensing electrode, an isolating layer and a conducting layer, wherein the sensing electrode is used for receiving touch operations; the isolating layer is arranged between the sensing electrode and the display module and is used for isolating electromagnetic interference between the display module and the sensing electrode; and the conducting layer is arranged between the isolating layer and the first frame and electrically connected with the isolating layer and the conducting structure of the first frame.

Description

technical field [0001] The invention relates to a touch device. Background technique [0002] At present, a touch device is usually composed of a display module and a touch module. However, after the display module and the touch module are bonded together, there is often electromagnetic interference between the display module and the touch module, which affects the operation of the touch device. stability. In the prior art, an isolation layer is often provided on the opposite side of the substrate (usually a glass substrate) where the sensing electrodes in the touch module are located, and a ground conductive sheet connected to the isolation layer is provided on the FPC (Flexible Printed Circuit) , cross or fold the conductive sheet to the side where the isolation layer is located, and electrically connect the isolation layer to the ground conductive sheet on the FPC through the ACF bonding (Anisotropic Conductive Film bonding) process. However, setting the ground conducti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041
Inventor 尤铭锵
Owner INTERFACE TECH CHENGDU CO LTD