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LED encapsulating method

A technology of light-emitting diodes and packaging methods, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve the problems of long molding time and low mold use efficiency, and achieves the advantages of reducing operation waiting time, efficient packaging process, and improving use efficiency. Effect

Inactive Publication Date: 2013-09-25
ZHANJING TECH SHENZHEN +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] When the industry uses injection molding for packaging, the plastic filled in the mold needs to be completely cured in a temperature environment of 180 to 200 degrees for 120 to 180 seconds, because the molding time of the plastic in the mold is longer , resulting in inefficient use of molds

Method used

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Embodiment Construction

[0018] The packaging method of the light emitting diode 100 of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0019] Step 1: See first figure 1 , provide an electrode structure 10, which includes a first electrode 11 and a second electrode 12, the first electrode 11 and the second electrode 12 are spaced apart from each other to form a gap 13, each electrode 11, 12 includes an upper surface 14 and The upper surface 14 is opposite to the lower surface 15 .

[0020] Step two: see figure 2 , provide a mold 20, which includes a bottom mold 21 and a top mold 22. The top of the bottom mold 21 is a flat surface, which is used to abut against the lower surface of the electrode structure 10 to carry the electrode structure 10 . The top mold 22 abuts against the upper surface of the electrode structure 10 and together with the upper surface of the electrode structure 10 forms a cavity 30 for subsequent injection mold...

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Abstract

The invention discloses an LED encapsulating method. The LED encapsulating method comprises the steps of providing an electrode structure, wherein the electrode structure comprises a first electrode and a second electrode which are arranged at intervals; providing a die and enabling a cavity body to be formed between the die and the electrode structure; adding fluid materials into the cavity body in an injection molding mode and precuring the fluid materials; removing the die; transferring the electrode structure with the precured fluid materials to an oven and carrying out complete curing; arranging a light-emitting component on the electrode structure, wherein the light-emitting component is electronically connected with the two electrodes; arranging an encapsulating layer on the light-emitting component in a covering mode. Compared with the prior art, the LED encapsulating method has the advantages that the die is removed during the precuring of the fluid materials to get ready for the next injection molding round, and at the same time the performing structure is transferred to be completely cured and formed under high temperature, and therefore waiting time is greatly reduced, the utilizing rate of the die is improved, the encapsulating process is more efficient, and mass production is facilitated.

Description

technical field [0001] The invention relates to a semiconductor packaging method, in particular to a light emitting diode packaging method. Background technique [0002] Light Emitting Diode (LED) is a semiconductor element that can convert current into light in a specific wavelength range. With its advantages of high luminous efficiency, small size, light weight, and environmental protection, it has been widely used in current in various fields. Before the light-emitting diode is applied to the above fields, the light-emitting diode chip needs to be packaged to protect the light-emitting diode chip. [0003] When the industry uses injection molding for packaging, the plastic filled in the mold needs to be completely cured in a temperature environment of 180 to 200 degrees for 120 to 180 seconds, because the molding time of the plastic in the mold is longer , resulting in inefficient use of the mold. Therefore, the encapsulation efficiency needs to be further improved. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
CPCH01L2224/48091H01L2224/48247H01L2224/48257H01L2924/00014
Inventor 林厚德张超雄
Owner ZHANJING TECH SHENZHEN