Passive-driven micro-channel heat-sink cooling device

Abstract

The invention discloses a passive-driven micro-channel heat-sink cooling device which is used for a high-power microelectronic device or an LED lamp. The passive-driven micro-channel heat-sink cooling device comprises a copper plate piece micro-channel array heat sink, copper capillary tubes and a liquid filling opening. The two ends of each micro-channel in the copper plate piece heat sink respectively comprise a stair-shaped sudden expansion which is used for being directly connected with the outside capillary tubes in a plug-pull mode, and the sudden expansions and the capillary tubes are sealed in a cementing mode or a silver soldering mode. The copper plate piece heat sink and the capillary tubes are connected to form a three-dimensional space structure which can be filled with a certain volume of liquid working media, the liquid working media in the heat-sink micro-channels can generate phase transition and sharp oscillation motion in a heating state, heat is transmitted to the capillary tubes from endothermic working media in the heat sink, heat is dissipated to surroundings through free convection or fan forced convection on the sides of the capillary tubes, and therefore the purpose of heat-sink cooling of a heating device connected with the heat sink is achieved. The passive-driven micro-channel heat-sink cooling device has the advantages of being compact in structure, low in manufacturing cost, free of addition of auxiliary devices and capable of stably operating for a long time.

Description

Technical field [0001] The invention relates to the technical field of heat dissipation and cooling of high-power microelectronic devices or LED lamps, in particular to a passive, that is, a micro-channel cooling device without additional auxiliary devices or device drives. Background technique [0002] In recent years, with the rapid development of microelectronics technology, various information and communication products are achieving high integration and miniaturization at an unprecedented speed, which directly leads to a significant increase in their working heat load and heat generation per unit area. The negative impact of components is great, and the heat dissipation problem has become increasingly prominent, and has become an important bottleneck restricting its development. [0003] The heat dissipation problem also affects high-power LED lights for lighting purposes. If the high-power LED lamp cannot improve the heat dissipation condition and remove the high heat accumu...

AI Technical Summary

Problems solved by technology

However, forced convection cooling of microchannels requires external power devices or auxiliary equipment, which increases the complexity and cost of the system, and relies heavily on external coolant and power supply, which reduces its safety and reliability, and restricts its popularization and application to a certain extent.

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