Three-dimensional pulsating heat pipe heat radiation and cooling device with flat plate microchannel evaporator

Abstract

The invention discloses a three-dimensional pulsating heat pipe heat radiation and cooling device with a flat plate microchannel evaporator. The three-dimensional pulsating heat pipe heat radiation and cooling device comprises the metal plate evaporator and capillary pipes, wherein a microchannel array is arranged in the metal plate evaporator. The bottom face of the metal plate evaporator is used for being connected with a high-power microelectronic device or an LED lamp. Microchannels in the metal plate evaporator are arranged between the upper surface and the bottom face of the metal plate evaporator. End openings of the microchannels are formed in the left side and the right side of the metal plate evaporator. The left end of one capillary pipe is in sealed connection with the end opening of the microchannel at the rearmost end of the left side of the metal plate evaporator, and the other end of the capillary pipe is in sealed connection with the end opening of the microchannel at the headmost end of the right side of the metal plate evaporator. The left ends of the rest of the capillary pipes are in sealed connection with the end openings of the previous microchannels on the left side of the metal plate evaporator, and the other ends of the rest of the capillary pipes are in sealed connection with the end openings of the next microchannels on the right side of the metal plate evaporator. The capillary pipes communicate with the microchannels to form a three-dimensional space loop structure. Cooling working media are injected in the microchannels and the capillary pipes.

Description

technical field [0001] The invention relates to the technical field of heat dissipation and cooling of high-power microelectronic devices or LED lamps, in particular to a three-dimensional pulsating heat pipe heat dissipation and cooling device with a flat plate microchannel evaporator. Background technique [0002] In recent years, with the rapid development of microelectronics technology, various information and communication products are being highly integrated and miniaturized at an unprecedented speed, which directly leads to a significant increase in their working heat load and heat generation per unit area. The negative impact of components is great, and the problem of heat dissipation is becoming more and more prominent, and has become an important bottleneck restricting its development. The heat dissipation problem also affects high-power LED lamps based on lighting purposes. If the heat dissipation conditions of high-power LED lamps cannot be improved in time to re...

AI Technical Summary

Problems solved by technology

However, the forced convection cooling of the microchannel in this device requires an external power unit or auxiliary equipment, which increases the complexity and cost of the system, and relies heavily on external coolant and power supply, which reduces its safety and reliability. Restricted its popularization and application

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