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A polishing device with adjustable polishing area

A polishing device and adjustable technology, which is applied in the direction of polishing machine tools, metal processing equipment, manufacturing tools, etc., can solve the problems of strict size and surface requirements, and achieve the effect of flexible adjustment

Active Publication Date: 2016-04-13
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a polishing device with adjustable polishing area to solve the problem that the traditional polishing device has strict requirements on the size and surface of the workpiece.

Method used

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  • A polishing device with adjustable polishing area
  • A polishing device with adjustable polishing area
  • A polishing device with adjustable polishing area

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Such as Figure 1~4 , the embodiment of the present invention is provided with workbench, fixture 6, polishing disc rotation mechanism, polishing disc tilting mechanism; The workbench is provided with base 1, X-axis bearing plate 2, X-axis guide rail 2-1, X-axis slider, X-axis linear motor (not shown), Y-axis carrier plate 3, Y-axis guide rail 3-1, Y-axis slider 3-2, Y-axis linear motor (not shown), Z-axis carrier plate 4, Z-axis guide rail 4-1. Z-axis slider, Z-axis linear motor (not shown) and vertical plate 5; the polishing disc rotation mechanism is provided with a polishing disc 8, an end surface polishing pad 9, a circular surface polishing pad 10, and a servo motor 11 and motor base 12; the polishing disc tilt mechanism is provided with a rotating disk 13, arc rack 14, gear 15, servo motor 16 and motor base 17; the X-axis bearing plate 2 and the base 1 s...

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Abstract

The invention discloses a polishing device with an adjustable polishing area and relates to a polishing device. The polishing device with the adjustable polishing area is provided with a workbench, a fixture, a polishing disk autoroatation mechanism and a polishing disk inclination mechanism, wherein the workbench is provided with a base, an X-axis bearing plate, an X-axis guide rail, an X-axis sliding block, an X-axis linear motor, a Y-axis bearing plate, a Y-axis guide rail, a Y-axis sliding block, a Y-axis linear motor, a Z-axis bearing plate, a Z-axis guide rail, a Z-axis sliding block, a Z-axis linear motor and a vertical plate, wherein the polishing disk autoroatation mechanism is provided with a polishing disk, an end surface polishing cushion, a round surface polishing cushion, a servo motor and a motor cabinet; and the polishing disk inclination mechanism is provided with a rotary disk, an arc-shaped rack, a gear, a servo motor and a motor cabinet. According to different sizes and appearances of workpieces, the polishing position and the polishing mode can be regulated, the local polishing, the overall polishing and the angle polishing of the workpieces can be realized, and therefore the polishing device is flexible to regulate and is convenient and feasible.

Description

technical field [0001] The invention relates to a polishing device, in particular to a polishing device with an adjustable polishing area. Background technique [0002] The basic principle of the Chemical Mechanical Polishing (CMP) process is to compare the workpiece to be polished with a certain downforce and a polishing liquid (a mixture of ultrafine particles, chemical oxidizers and liquid media) relative to a polishing machine. The pad rotates, and the mechanical grinding of abrasive grains and the corrosion of chemical oxidants are used to complete the material removal on the surface of the workpiece and obtain a smooth surface ([1]MalikF.HasanM.ManufacturabilityoftheCMPprocess[J].ThinSolidFilms,1995,270: 612-615; [2] JairathR, FarkasJ, HuangCK, et al. Chemical-mechanical polishing: process manufacturability [J]. Solid State Technology, 1994, 7:71-75). With the development of science and technology and the increasing demand for component precision, more and more materi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B39/06
Inventor 杨炜叶卉吴沿鹏郭隐彪
Owner XIAMEN UNIV
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