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Modified corn starch adhesive and preparation method thereof

A technology of corn starch and adhesive glue, applied in the direction of starch adhesive, adhesive type, non-polymer adhesive additive, etc., can solve the problems of poor drying speed and stability

Inactive Publication Date: 2013-10-02
ZHANGJIAGANG LUYUAN STARCH FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a kind of cardboard with strong adhesive force, good fluidity, non-toxic and tasteless, and good stiffness of cardboard, aiming at the defects of cardboard drying speed and poor stability in existing general corn starch adhesives. Modified corn starch adhesive glue with fast drying speed and preparation method thereof

Method used

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Embodiment Construction

[0009] (1) Accurately weigh 20% cornstarch by its weight percentage; Hydrogen peroxide 1.8%; Sodium hydroxide 1.5%; Tributyl phosphate 0.15%; Borax 0.2%; Dispersant 0.3%; 0.6%; water 76%, spare.

[0010] Preparation

[0011] Add polyvinyl alcohol to one-half of the total amount of water and stir to raise the temperature to 98°C to make it completely dissolve, add cornstarch and stir after degrading to 60°C, keep warm for 60 minutes for modification treatment, then add hydrogen peroxide and sodium hydroxide and stir for 30 minutes , add tributyl phosphate and borax, disperse and complex for 40 minutes, and finally add dispersant and drier and stir evenly.

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Abstract

The invention relates to a modified corn starch adhesive and a preparation method thereof. The modified corn starch adhesive is mainly composed of corn starch, hydrogen peroxide, sodium hydroxide, tributyl phosphate, borax, a dispersant, a drier, polyvinyl alcohol, water and the like. The modified corn starch adhesive has the characteristics of strong adhesion, good fluidity, non-toxicity, and tastelessness; and cardboards prepared through using the modified corn starch adhesive have the characteristics of good stiffness, fast drying speed and the like.

Description

technical field [0001] The invention relates to a modified corn starch adhesive glue and a preparation method thereof, belonging to the technical field of compound modified starch. Background technique [0002] Starch glue has been widely used as a general-purpose natural adhesive. This is mainly based on two reasons. One is that starch resources are abundant, the price is cheap, and it is non-toxic, odorless, and pollution-free; The reduction poses a threat to chemical products based on petroleum, so that many companies are looking for substitutes, and the adhesive glue used in the cardboard industry has always been using sodium silicate. Due to its high alkali content, it is corrosive to paper. Large, the produced cardboard is easy to get damp, deformed, damaged, or even corroded the inner packaging goods, and the structure, physical properties and chemical properties of starch are changed by physical and chemical methods or biochemical methods, and a variety of starches w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J103/02C09J129/04C09J11/04C09J11/06
Inventor 施东辉
Owner ZHANGJIAGANG LUYUAN STARCH FACTORY
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