Nanometer binder and polycrystalline diamond clad sheet used for cutter, prepared by utilizing same
A diamond polycrystal and bonding agent technology, applied in the application of ultra-high pressure process, etc., to achieve the effect of eliminating adverse effects, breaking through technical bottlenecks, breaking through high wear resistance and high impact toughness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0023] A diamond polycrystalline composite sheet for cutting tools, including a diamond polycrystalline layer and a cemented carbide substrate. The diamond polycrystalline layer is composed of the following raw materials in weight percentages: 94% diamond powder (particle size 4 μm) and 6% nano-bonding agent, The cemented carbide substrate is composed of the following raw materials by weight percentage: 89.5% of tungsten carbide powder (particle size 1.8 μm) and 10.5% of analytically pure cobalt powder (1.0 μm); the nano-bonding agent is composed of the following raw materials by weight percentage: analysis Pure Co powder (particle size 20nm) 97.5%, analytical pure NbC powder (particle size 20nm) 1.5%, analytical pure B powder (particle size 30nm) 1%.
[0024] The preparation method of the above-mentioned polycrystalline diamond composite sheet comprises the following steps:
[0025] (1) Purification and reduction treatment: Boil the diamond powder with 35% sodium hydroxide aq...
Embodiment 2
[0031] A diamond polycrystalline composite sheet for cutting tools, including a diamond polycrystalline layer and a cemented carbide substrate. The diamond polycrystalline layer is composed of the following raw materials in weight percentages: 97% of diamond powder (particle size 6 μm) and 3% of nano-bonding agent, The cemented carbide substrate is composed of the following raw materials in weight percentage: 90.5% of tungsten carbide powder (particle size 2.2 μm) and 9.5% of analytically pure cobalt powder (1.2 μm); the nano-bonding agent is composed of the following raw materials in weight percentage: analysis Pure Co powder (particle size 25nm) 99.5%, analytical pure NbC powder (particle size 25nm) 0.45%, analytical pure B powder (particle size 35nm) 0.05%.
[0032] The preparation method of the above-mentioned polycrystalline diamond composite sheet comprises the following steps:
[0033] (1) Purification and reduction treatment: Boil the diamond powder with 40% sodium hyd...
Embodiment 3
[0039] A diamond polycrystalline composite sheet for cutting tools, including a diamond polycrystalline layer and a cemented carbide substrate, the diamond polycrystalline layer is composed of the following raw materials in weight percentage: 95% diamond powder (particle size 5 μm) and 5% nano-bonding agent, The cemented carbide substrate is composed of the following raw materials in weight percentage: 90% of tungsten carbide powder (particle size 2.0 μm) and 10% of analytically pure cobalt powder (1.0 μm); the nano-bonding agent is composed of the following raw materials in weight percentage: analysis Pure Co powder (particle size 23nm) 99%, analytical pure NbC powder (particle size 22nm) 0.8%, analytical pure B powder (particle size 33nm) 0.2%.
[0040] The preparation method of the above-mentioned polycrystalline diamond composite sheet comprises the following steps:
[0041] (1) Purification and reduction treatment: Boil the diamond powder with 37% sodium hydroxide aqueous...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com