A kind of solar cell assembly based on glass conductive backplane and its manufacturing method

A solar cell and conductive backplane technology, which is applied in the manufacture of electrical components, semiconductor devices, and final products, can solve problems such as high cost and poor reliability, and achieve the effect of improving reliability and avoiding battery sheet bending

Active Publication Date: 2016-06-01
JIANGSU SUNPORT POWER CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: The present invention proposes a solar cell module based on a glass conductive back sheet and its manufacturing method, which solves the problems of poor reliability and high cost of the existing back contact solar cell module technology

Method used

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  • A kind of solar cell assembly based on glass conductive backplane and its manufacturing method
  • A kind of solar cell assembly based on glass conductive backplane and its manufacturing method
  • A kind of solar cell assembly based on glass conductive backplane and its manufacturing method

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Embodiment 1

[0019] Embodiment 1: as figure 1 As shown, positive electrodes 9 and negative electrodes 8 are discretely distributed on the back of the existing MWT back contact battery. In the assembly production of such back contact cells, it is necessary to connect the positive electrode 9 with a conductor and the negative electrode 8 with another conductor.

[0020] In this embodiment, a piece of ordinary silicate glass with a thickness of 2 mm and a warpage of 5 mm is selected as the glass back plate 1 . The glass backplane 1 is firstly cleaned on the surface, and then sent to thermal evaporation coating equipment for thermal evaporation coating of the aluminum film. During evaporation, the vacuum degree is controlled at 10 -3 Pa, the coating rate is 500nm / s, the total film thickness is 60um, and the time is two minutes. After the film coating is completed, the upper surface of the glass backplane 1 is covered with aluminum film. The aluminum film also needs to be processed into a p...

Embodiment 2

[0022]Embodiment 2: In this embodiment, the coating rate of the thermally evaporated aluminum film is 200 nm / s and the film thickness is 20 um on the glass backplane 1 with a thickness of 1 mm and a warpage of 1 mm. Then, a patterned aluminum film 2 is produced by using a sandblasting machine and a mask plate. The patterned aluminum film 2 is composed of strip-shaped aluminum strips, and the distance between two adjacent aluminum strips is 1 mm. The stencil used for depositing the conductive adhesive connection point 3 on the patterned aluminum film 2 has a thickness of 100um and a circular hole diameter of 1mm. The height of the printed conductive glue connection point 3 is 100um. The conductive adhesive connection point 3 includes copper particles with a diameter of 1 um, and the copper particles are wrapped with a silver film to resist oxidation. After the conductive adhesive connection point 3 is printed, a layer of encapsulation film 4 is laid on the surface of the patte...

Embodiment 3

[0023] Embodiment 3: In this embodiment, the coating rate of the thermally evaporated aluminum film on the glass backplane 1 with a thickness of 3 mm and a warpage of 10 mm is 350 nm / s, and the film thickness is 40 um. Then, a patterned aluminum film 2 is produced by using a sandblasting machine and a mask plate. The patterned aluminum film 2 is composed of strip-shaped aluminum strips, and the distance between two adjacent aluminum strips is 3 mm. The stencil used for depositing the conductive adhesive connection point 3 on the patterned aluminum film 2 has a thickness of 500um and a circular hole diameter of 5mm. The height of the printed conductive adhesive connection point 3 is 500um. The conductive adhesive connection point 3 contains copper particles with a diameter of 20um, and the copper particles are wrapped with a silver film to resist oxidation. After the conductive adhesive connection point 3 is printed, a layer of encapsulation film 4 is laid on the surface of th...

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Abstract

The invention discloses a solar cell module based on a glass conductive backboard and a manufacturing method of the solar cell module. The solar cell module is simple and reliable, low-cost common glass and the processing techniques like mature glass coating and sand blasting are utilized, an existing expensive backboard (a copper-clad plate) and existing complex photolithography are replaced, requirements for packaging techniques of low-cost and large-capacity back contact cell modules are met, and curve of battery pieces caused by high-temperature welding is avoided. Water and steam are prevented from affecting metal films and the battery pieces by means of protection of double-surface glass, and using reliability of the module is improved. Therefore, the solar cell module based on the glass conductive backboard and the manufacturing method of the solar cell module are particularly suitable for industrialization of the back contact cell modules.

Description

technical field [0001] The invention relates to a solar cell component based on a glass conductive back plate and a manufacturing method thereof, belonging to the field of solar cell components. Background technique [0002] Existing conventional crystalline silicon solar cells are generally of H-shaped structure. There are two to three symmetrical silver busbars on both sides of the battery to collect the current generated during power generation. When packaged into components, tin-coated Under the action of the electric soldering iron, the brazing strip welds the main grid lines of the series cells to realize the series connection between multiple cells, and then laminates and packages them into solar cell modules through backplane, EVA, tempered glass and other materials for solar power stations. use. The main disadvantages of this conventional battery structure are the excessive consumption of expensive silver and the low photoelectric conversion efficiency of the batte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L31/049
CPCY02E10/50Y02P70/50
Inventor 张凤英
Owner JIANGSU SUNPORT POWER CORP LTD
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