Local plating device for lead frame
A local electroplating and lead frame technology, applied in the direction of circuits, semiconductor devices, etc., can solve problems such as failure to meet quality requirements, blackening of finished product functional areas, leakage of nickel plating solution, etc., to solve the problem of plating solution leakage, plating method Variety of effects
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[0025] The present invention is described in detail below in conjunction with accompanying drawing:
[0026] Such as Figure 1-8 As shown, a lead frame partial electroplating equipment includes a linear platen type electroplating mechanism 2 for partial electroplating of a plated piece 1, and a feed guide positioning mechanism 3 is provided on the feed side of the linear platen type electroplating mechanism 2. The discharge side of the platen type electroplating mechanism 2 is provided with a discharge guiding and positioning mechanism 4. The linear platen electroplating mechanism 2 includes a cuboid plated body 21 with an anode nozzle inside to spray plate the plated parts. The plated piece 1 is press-attached to the pressure applying device 22 on the sprayed surface of the cuboid plated body 21 .
[0027] The pressure applying device 22 includes a colloid pressure belt 221 attached to the surface of the plated part 1 and a high-pressure cylinder 222 that pressurizes the col...
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