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Local plating device for lead frame

A local electroplating and lead frame technology, applied in the direction of circuits, semiconductor devices, etc., can solve problems such as failure to meet quality requirements, blackening of finished product functional areas, leakage of nickel plating solution, etc., to solve the problem of plating solution leakage, plating method Variety of effects

Active Publication Date: 2013-10-16
ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] According to the requirements of the customer's market, it is necessary to use precious metals as the base layer on the base material, then do protective electroplating in the functional area, and finally the functional plating in the lead area, so that the protective electroplating layer: local electroplating nickel has a considerable High requirements, and the existing technology is to use wheel-shaft partial nickel plating, the problem of nickel plating solution leakage is quite serious, and the functional area of ​​the finished product after electroplating will be blackened, which completely fails to meet the quality requirements of the market

Method used

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  • Local plating device for lead frame
  • Local plating device for lead frame
  • Local plating device for lead frame

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Embodiment Construction

[0025] The present invention is described in detail below in conjunction with accompanying drawing:

[0026] Such as Figure 1-8 As shown, a lead frame partial electroplating equipment includes a linear platen type electroplating mechanism 2 for partial electroplating of a plated piece 1, and a feed guide positioning mechanism 3 is provided on the feed side of the linear platen type electroplating mechanism 2. The discharge side of the platen type electroplating mechanism 2 is provided with a discharge guiding and positioning mechanism 4. The linear platen electroplating mechanism 2 includes a cuboid plated body 21 with an anode nozzle inside to spray plate the plated parts. The plated piece 1 is press-attached to the pressure applying device 22 on the sprayed surface of the cuboid plated body 21 .

[0027] The pressure applying device 22 includes a colloid pressure belt 221 attached to the surface of the plated part 1 and a high-pressure cylinder 222 that pressurizes the col...

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Abstract

The invention discloses a local plating device for a lead frame, which comprises a straight-line plate-pressing plating mechanism which is used for performing local plating on a workpiece. A feed guiding orientation mechanism is arranged at the feed side of the straight-line plate-pressing plating mechanism, and a discharge guide orientation mechanism is arranged at the discharging side of the straight-line plate-pressing plating mechanism. The straight-line plate-pressing plating mechanism is composed of a cuboid plating body with an internal anodic nozzle for spraying the workpiece. The cuboid plating body is provided with a pressure applying device which is used for pressing the workpiece on the spraying surface of the cuboid plating body. The local plating device adopts straight-line plate-pressing plating for local nickel plating, thus overcoming the problem of leakage of a plating solution of wheel type mold plating, and breaking through a traditional single continuous electroplating mode. Therefore, electroplating modes are diversified, and changing and developing market demands are satisfied.

Description

【Technical field】 [0001] The invention relates to electroplating equipment, in particular to a partial electroplating equipment for a lead frame, and belongs to the technical field of electroplating. 【Background technique】 [0002] According to the requirements of the customer's market, it is necessary to use precious metals as the base layer on the base material, then do protective electroplating in the functional area, and finally the functional plating in the lead area, so that the protective electroplating layer: local electroplating nickel has a considerable High requirements, and the existing technology is to use wheel-shaft partial nickel plating, the problem of nickel plating solution leakage is quite serious, and the functional area of ​​the finished product after electroplating will be blackened, which completely fails to meet the quality requirements of the market. 【Content of invention】 [0003] The purpose of the present invention is to overcome the deficienci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D7/12
Inventor 刘国强
Owner ACKOTEC ZHONGSHAN ELECTRONICS PARTS