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Die for glue application of CPU support

A CPU bracket and mold technology, applied in mechanical equipment, connecting components, etc., can solve the problems of low work efficiency, deviation, easy to emerge, etc., and achieve the effect of convenient operation, simple structure, and improved accuracy.

Active Publication Date: 2015-04-08
太仓伟利达铭板科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]In the process of computer assembly, most of the assembly parts are connected internally, therefore, laminating and gluing is also a common method, such as Figure 1 shows the CPU bracket, which includes a back-shaped frame (1 '), the first bracket (2') and the second bracket (3') arranged at the four corners of the back-shaped frame body (1') and extending along the length direction of the back-shaped frame body (1') '), the third bracket (4') and the fourth bracket (5'), in order to facilitate the fixing of the CPU, the first bracket (2'), the second bracket (3'), the third bracket (4' ) and the fourth bracket (5') are respectively provided with connecting seats (6'), and the four connecting seats (6') are located on the first bracket (2'), the second bracket (3'), the third The underside of the bracket (4') and the fourth bracket (5') also needs to be glued on the back-shaped frame body (1'), so that the CPU bracket has better stability in use. However, At present, the method of pasting the back glue is all manual operation, not only the work efficiency is low, but also the back glue is easy to come out of the outer contour of the frame body (1′), resulting in problems when the CPU bracket is attached to other assembly parts. deviation

Method used

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  • Die for glue application of CPU support
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  • Die for glue application of CPU support

Examples

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Embodiment Construction

[0024] Such as figure 1 As shown, its CPU bracket includes a back-shaped frame body 1, a first bracket 2, a second bracket 3, and a third bracket that are arranged at four corners of the back-shaped frame body 1 and extend along the length direction of the back-shaped frame body 1 respectively. The bracket 4 and the fourth bracket 5 , and the connection base 6 respectively arranged on the bottom surfaces of the first bracket 2 , the second bracket 3 , the third bracket 4 and the fourth bracket 5 .

[0025] Such as Figure 2 to Figure 4 As shown, the mold provided in this embodiment is dedicated to lamination and gluing of the CPU bracket, which includes a mold body 7, and a positioning module 8 that is arranged on the mold body 7 and has the same shape as the inner cavity of the return frame body 1, and is arranged on the mold body The four ejector pins 9 corresponding to the four connection seats 6 on the 7, and the adjustment device capable of adjusting each ejector pi...

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Abstract

The invention relates to a die for glue application of a CPU support. The CPU support comprises a support body shaped like the Chinese character 'hui', a first support, a second support, a third support, a fourth support and connecting bases, wherein the first support, the second support, the third support and the fourth support are arranged at positions of the four corners of the support body shaped like the Chinese character 'hui' and extend along the length direction of the support body shaped like the Chinese character 'hui', and the connecting bases are arranged on the bottom surfaces of the first support, the second support, the third support and the fourth support respectively. The die comprises a die body, a positioning module arranged on the die body and in a shape same as that of the inner cavity of the support body shaped like the Chinese character 'hui', four ejector rods arranged on the die body and correspond to the four connecting bases in a one-to-one mode, and an adjusting device capable of adjusting the stretching out and drawing back, along the height direction of the die body, of each ejector rod, wherein the positioning module extends upwards along the height direction of the die body and forms a protrusion. According to the die for glue application of the CPU support, back glue can be applied to a gluing area of the support body shaped like the Chinese character 'hui' in a one-time forming mode, back glue applying efficiency is improved, and back glue applying accuracy is improved.

Description

technical field [0001] The invention relates to a mold, in particular to a mold specially used for laminating and gluing CPU brackets. Background technique [0002] In the process of computer assembly, most of the assembly parts are connected internally. Therefore, laminating and gluing is also a common method, such as figure 1 The shown CPU bracket includes a return-shaped frame body (1'), which is arranged at four corners of the return-shaped frame body (1') and extends along the length direction of the return-shaped frame body (1') The first bracket (2'), the second bracket (3'), the third bracket (4') and the fourth bracket (5'), in order to facilitate the fixing of the CPU, on the first bracket (2'), The second bracket (3'), the third bracket (4') and the fourth bracket (5') are respectively provided with connecting seats (6'), and the four connecting seats (6') are located on the first bracket ( 2'), the second bracket (3'), the third bracket (4') and the underside o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16B11/00
Inventor 欧阳曼平王文科左熊常深山李林何政杨艳桃郑礼貌
Owner 太仓伟利达铭板科技有限公司