A chip with a semiconductor DC transformer structure

Abstract

The invention provides a chip. The chip comprises a substrate and at least one semiconductor direct current voltage transformation structure. Each semiconductor direct current voltage transformation structure comprises at least one semiconductor electro-optic conversion unit and at least one semiconductor photoelectric conversion unit, wherein the semiconductor electro-optic conversion units are used for converting input electric energy into optical energy, the semiconductor photoelectric conversion units are used for converting the optical energy into the electric energy, the number of the semiconductor electro-optic conversion units and the number of the semiconductor photoelectric conversion units are in a certain proportion so as to achieve direct current voltage transformation, and the working light ray frequency spectrums of the semiconductor electro-optic conversion units and the working light ray frequency spectrums of the semiconductor photoelectric conversion units are matched. According to the chip, the direct current voltage transformation function can be achieved. The chip has the advantages of being simple in structure and capable of being integrated in a total sheet mode.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip with a semiconductor DC transformer structure. Background technique [0002] With the continuous development of semiconductor technology, on the one hand, the scale of integrated circuit chips is getting larger and higher, and the integration level is getting higher and higher. Various circuits and even functional modules are integrated on the same chip, such as radio frequency circuits, analog circuits and digital circuits. , various MEMS (MicroElectronicMechanicalSystem, microelectromechanical system) devices, flash memory, etc., and they require different operating voltages, such as the voltage of digital circuits is about 1V, flash memory requires a high write voltage, and some sensor devices may require tens of V or even The working voltage of hundreds of V, and even the circuit modules of the same voltage will affect each other through the power line, such as ...

AI Technical Summary

Problems solved by technology

[0004] 1. Requires a large number of off-chip power supply components, high cost, susceptible to interference, and complex power management;

[0005] 2. Multiple groups of power interfaces require a large number of on-chip input / output buffers for bonding chip pads, which occupy a large area and require a large number of bonding wires;

[0006] 3. When low voltage and high current are introduced from the outside, the voltage drop loss on the resistance of the chip interconnection wire is very large, and a large number of long-distance power supply wiring is required, which occupies a large amount of chip area, which is not conducive to heat dissipation, and is also not conducive to the small size of the chip and cost reduction

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