Sheet substrate, electronic apparatus, electronic parts, method for testing electronic parts, and method for manufacturing electronic parts

Abstract

A sheet substrate includes a plurality of substrate regions arranged in a matrix, an integrated circuit disposed in each of the substrate regions, and a first implementation electrode and a second implementation electrode disposed in each of the substrate regions and electrically connected to the integrated circuit. The sheet substrate according to an embodiment of the invention further includes first terminals to each of which the first implementation electrodes arranged in a row of part of the substrate regions are connected in parallel to each other and second terminals to each of which the second implementation electrodes arranged in a column of part of the substrate regions and can activate an arbitrary one of the integrated circuits that is specified by selected ones of the first terminals and the second terminals.

Description

technical field [0001] The present invention relates to a sheet substrate, an electronic component, an electronic device, an inspection method for an electronic component, and a method for manufacturing an electronic component, and more particularly, to a technology that enables easy post-mounting inspection of electronic components mounted on an electronic component . Background technique [0002] Conventionally, a so-called multiple-at-a-time manufacturing method has been used as an efficient manufacturing method for electronic components. Specifically, a sheet substrate having a plurality of substrate regions is prepared, and electronic components such as piezoelectric vibrators and ICs (Integrated Circuits) are arranged in each substrate region, and the The thin substrate is divided into individual pieces according to the boundary, so as to obtain individual electronic components. [0003] In the electronic components described above, work such as operation confirmatio...

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Problems solved by technology

[0006] However, in the case of the structure of Patent Document 1, since the electronic components arranged in each substrate area are activated simultaneously, there is a possibility that the electronic components interfere with each other.

For example, when the electronic component is an integrated circuit connected to a piezoelectric vibrating piece, sometimes the piezoelectric vibrating pieces will interfere with each other, and the resonance frequency of the piezoelectric vibrating piece will change, making it difficult to perform proper inspection.

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