Imaging apparatus

A technology for imaging devices and solid-state imaging elements, which is applied in radiation control devices, image communications, televisions, etc., and can solve problems such as increased heat generation of chips, lower image quality of pixel arrays, and complex manufacturing processes.

Active Publication Date: 2013-12-04
NIKON CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the manufacturing process becomes complicated and the yield becomes poor
In addition, during high-speed operation, the heat generated by the chip, especially the he

Method used

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Embodiment Construction

[0030] Next, an imaging device according to an embodiment of the present invention will be described with reference to the drawings.

[0031] figure 1 The imaging device 1 of this embodiment is shown. The imaging device 1 is a so-called digital single-lens reflex camera. In the imaging device 1, a lens barrel 3 is detachably mounted on a lens holder (not shown) of a camera body 2, and light passing through a lens 4 of the lens barrel 3 is disposed on the camera body 2. The image is formed on the sensor chip (solid-state image sensor) 5 of the multi-chip module 7 on the back side. The sensor chip 5 is a so-called bare chip of a CMOS image sensor or the like.

[0032] Such as figure 2 As shown, the multi-chip module 7 includes a sensor chip 5, an upper signal processing chip 50a, and a lower signal processing chip 50b.

[0033] The sensor chip 5 includes: a pixel array 20, which is composed of a plurality of pixels that output signals corresponding to incident light (herei...

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Abstract

This imaging apparatus includes a solid-state imaging device and a substrate. The solid-state imaging device includes a pixel array in which a plurality of pixels is arranged in a two-dimensional matrix, and a pad (51) which is provided corresponding to a pixel column of the pixel array and outputs signals from the pixels in the pixel column. A group of signal output terminals has a plurality of the pads (51) arranged in a line along the column direction of the pixel array. The group of signal output terminals is arranged in the row direction of the pixel array. A substrate (6) includes, for each group of signal output terminals, a laminated wiring obtained by laminating a plurality of wiring layers extending in the column direction of the pixel array. The laminated wiring (32) includes first terminal portions (61) provided at the positions corresponding to the pads (51) of the group of signal output terminals. The pad (51) and the first terminal portion (61) are coupled to each other via a bump (9).

Description

technical field [0001] The present invention relates to an imaging device for capturing an image of a subject. [0002] this application claims priority based on Japanese Patent Application No. 2010-251980 for which it applied on November 10, 2010, and uses the content here. Background technique [0003] In recent years, higher-speed operation is required for large-scale sensor chips used in so-called digital single-lens reflex cameras and the like. By providing an A / D converter for each column of the pixel array provided on this chip and performing signal processing in parallel, the processing speed of the A / D converter is kept relatively low, and low power consumption is realized. However, when high-speed processing is achieved, a sensor unit with low noise, a large dynamic range, and a high power supply voltage, and a digital circuit equipped with tiny transistors and operating at ultra-high speed with a low power supply voltage are composed of a single chip. Therefore,...

Claims

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Application Information

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IPC IPC(8): H01L27/146H01L27/14H04N5/369
CPCH04N5/335H01L27/14618H01L2924/0002H01L2924/00H04N25/00
Inventor 末延一彦
Owner NIKON CORP
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