39results about How to "Achieve high density" patented technology

The invention discloses a micro-vessel liver chip based on cell clusters. The micro-vessel liver chip comprises a micro-vessel system located on the upper layer, a blood-vessel-endothelium-like barrier system in the middle and a liver-organ multi-cell co-culture system on the lower layer, wherein the micro-vessel system and the liver-organ multi-cell co-culture system are arranged on own substrates respectively. The micro-vessel system comprises a bent vessel composed of multiple flow-stopping barriers in a staggered mode, and a micro-vessel inlet and a micro-vessel outlet are formed in the two ends of the bent vessel respectively. The blood-vessel-endothelium-like barrier system is composed of a porous film. The liver-organ multi-cell co-culture system comprises a cell cluster enrichment region and a multi-cell co-culture region, and a culture system inlet and a culture system outlet are formed in the two ends of the liver-organ multi-cell co-culture system respectively. A liver disease model can be established, research on pharmacokinetics and medicine activity can be performed, and the micro-vessel liver chip has the advantages of using a small quantity of samples, achieving medicine low consumption and being portable, economical, efficient and accurate.

The purpose of the present invention is to provide a probe whereby increased density of electronic components, being the measurement target, is possible on a circuit board. The probe (1) is capable of simultaneously measuring a plurality of locations. The probe (1) comprises: a plurality of main body sections (30) including central conductors (20) that come in contact with a connector (300); and a first member (50) that bundles the plurality of main body sections (30). A recessed section (C1), having the tips of the plurality of central conductors (20) protruding from the bottom surface thereof, is provided in the first member (50). The recessed section (C1) has a sloping surface (S1) that spreads from said bottom surface towards an opening.

A light detecting device for imaging comprises a plurality of light detectors (6) that are arranged on a substrate (5) one- or two-dimensionally, a low refractive index transparent layer (12) that is formed over the light detectors, and a plurality of high refractive index transparent portion (13) formed in a column-shape or a plate-like shape which are embedded in the low refractive index transparent layer along an arrangement direction of the light detectors. Two or more light detectors are arranged for one high refractive index transparent portion. When light inputted into the low refractive index transparent layer or the high refractive index transparent portion passes through these, a phase shift is caused in its wave surface and the light is separated into a 0-th order diffracted light, a 1st order diffracted light, and a -1st order diffracted light. Therefore, improvement of light use efficiency and a higher density of pixels can be realized.

An objective of the invention is to realize a circular conveying apparatus which can reduce bad conveying or conveying pollution generated with micromation of conveyed objects, and is helpful to realize high speed of conveying height or high density of conveying forms. The circular conveying apparatus (10) is provided with a recycling transfer portion (X) which makes conveyed objects excluded by a supply side arrangement path (11a) transfer to a recycling side conveying path (12a), and a supply transfer portion (Y) which makes conveyed objects conveyed by the recycling side conveying path (12a) transfer to the supply side arrangement path (11a). In the recycling transfer portion (X), a downstream end of an excluding path of the conveyed objects from the supply side arrangement path (11a) is above an upstream portion of the recycling side conveying path (12a) and hangs over, or in the supply transfer portion (Y), a downstream end of the recycling side conveying path (12a) is above an upstream portion of the supply side arrangement path (11a) and hangs over.

The performance of a solid state image sensor which is formed by performing divided exposure that exposes the entire chip by a plurality of times of exposure and in which each of a plurality of pixels arranged in a pixel array portion has a plurality of photodiodes is improved. In the divided exposure performed when the solid state image sensor is manufactured, a dividing line that divides an exposure region is defined to be located between a first photodiode and a second photodiode aligned in a first direction in an active region in a pixel and is defined to be along a second direction perpendicular to the first direction.

The invention discloses a micro-stirring friction welding process for electronic packaging and belongs to the technical field of electronic packaging. The problem that an existing electronic packagingtechnology is not ideal in densification and pollution freeness achieving effect and the problem that an existing stirring friction welding technology can hardly achieve direct welding on micro, small and thin structures. Firstly, a first bonding pad and a second bonding pad to be welded serve as a welding pad set; when the welding pad set is arranged at single points, a press-in hole is prefabricated and machined in a first substrate, the welding pad set is arranged between the first substrate and a second substate in parallel, the press-in hole and the center position of the welding pad setare arranged in a centering manner, and then the first substrate and the second substrate are compressed through a clamp; and a stirring head is coaxially aligned to the upper portion of the press-inhole, the stirring head is controlled to rotate at high speed and move downwards into the press-in hole and then is pressed into the first welding pad; and under the set press-in amount and holding time, the permanent metallurgy connection of the first welding pad and the second welding pad is achieved, and finally the stirring head is controlled to move out of the press-in hole upwards.

The invention relates to a no-bracket one year-one harvest one-plant one-root-tuber cultivation method for beautiful millettia roots. The no-bracket one year-one harvest one-plant one- root-tuber cultivation method comprises the following steps: carrying out field planting on beautiful millettia root seedlings in double rows in a staggered mode from every February to every March, and pruning plant vines when the plant vines of the beautiful millettia root seedlings grow to certain length to shape the beautiful millettia roots like umbrella-shaped arbuscular trees; pruning roots every June to Every August, and keeping one main root for each plant; soaking the roots of the beautiful millettia root seedlings and nutrient soil covering outside the roots in a root growth promoting agent; spraying and applying foliage fertilizer twice at each shoot adnation period. The no-bracket one year-one harvest one-plant one-root-tuber cultivation method for beautiful millettia roots provided by the invention has the advantages of being low in planting cost, short in planting period, good in root-tuber quality, high in yield, quick in investment recovery, easy to popularize, and the like.

The invention discloses a production process of high-density velvet. The production process comprises the following steps of interweaving warp yarns, weft yarns and pile warp yarns, cutting velvet, and carrying out after-treatment to obtain the high-density velvet. Pile heads protruding out of the base cloth are arranged between every two wefts of the prepared high-density velvet. In a first dent,one pile warp is added to two pile warps to form three pile warps, in the second dent, one pile warp is added to two pile warps to form three pile warps, and the pile warp consolidation weft of the second dent is one-weft staggered with the pile warp consolidation weft in the first dent. In this way, the pile warps in the two dents are clamped by the left ground warp and the right ground warp which are adjacent to each other, the W consolidation fastness is improved, pile roots of the pile warps are protected by the other two ground warps, and therefore although only one pile warp is additionally arranged in each dent, one pile head can be arranged between every two wefts due to the fact that the pile warps are properly added, and the velvet can truly reach high density and is deeply loved by the customer.

The invention relates to a winding, a stator and a motor. The winding comprises: a plurality of coils; each coil comprises a double-layer conductor module, a first conductor and a connecting conductormodule; the double-layer conductor module is connected with the first conductor through the connecting conductor module; the double-layer conductor module comprises a second conductor and a third conductor; and the connection conductor module comprises a first connection conductor and a second connection conductor. The second conductor and the third conductor are vertically arranged side by side,the output end of the second conductor is connected with the input end of the first conductor through the first connecting conductor, and the output end of the first conductor is connected with the input end of the third conductor through the second connecting conductor. According to the invention, the second conductor and the third conductor are arranged side by side up and down, so that the twoconductors have a capacitance effect under high-frequency pulse potential excitation, the loss is reduced when current flows through the conductors, the electrical load density of the motor can be improved, and the high density of the motor is realized.

The invention relates to a terminal mounting structure, a cable connector and a connector assembly. The terminal mounting structure comprises an insulator seat (51) andterminal assemblies. The terminal assemblies are installed in the insulator seat in a row mode, each terminal assembly comprises paired signal terminals (61) and grounding terminals (62), the paired signal terminals form a differential signal pair (63), and the differential signal pair (63) is arranged between the grounding terminals (62); one end, extending out of the insulator seat, of the terminal assembly is an elastic contact area (601), and the other end of the terminal assembly is a wiring area (603) connected with a cable; and the insulator seat (51) is provided with at least two rows of terminal assemblies at intervals in the front-back direction. By means of the technical scheme, the terminals are arranged in rows and assembled on the front row and the rear row of the insulator seat respectively, the high-speed transmission performance is improved, and meanwhile the size of the connector can be effectively reduced.

This imaging apparatus includes a solid-state imaging device and a substrate. The solid-state imaging device includes a pixel array in which a plurality of pixels is arranged in a two-dimensional matrix, and a pad (51) which is provided corresponding to a pixel column of the pixel array and outputs signals from the pixels in the pixel column. A group of signal output terminals has a plurality of the pads (51) arranged in a line along the column direction of the pixel array. The group of signal output terminals is arranged in the row direction of the pixel array. A substrate (6) includes, for each group of signal output terminals, a laminated wiring obtained by laminating a plurality of wiring layers extending in the column direction of the pixel array. The laminated wiring (32) includes first terminal portions (61) provided at the positions corresponding to the pads (51) of the group of signal output terminals. The pad (51) and the first terminal portion (61) are coupled to each other via a bump (9).