41results about How to "Achieve high density" patented technology

The invention discloses a micro-vessel liver chip based on cell clusters. The micro-vessel liver chip comprises a micro-vessel system located on the upper layer, a blood-vessel-endothelium-like barrier system in the middle and a liver-organ multi-cell co-culture system on the lower layer, wherein the micro-vessel system and the liver-organ multi-cell co-culture system are arranged on own substrates respectively. The micro-vessel system comprises a bent vessel composed of multiple flow-stopping barriers in a staggered mode, and a micro-vessel inlet and a micro-vessel outlet are formed in the two ends of the bent vessel respectively. The blood-vessel-endothelium-like barrier system is composed of a porous film. The liver-organ multi-cell co-culture system comprises a cell cluster enrichment region and a multi-cell co-culture region, and a culture system inlet and a culture system outlet are formed in the two ends of the liver-organ multi-cell co-culture system respectively. A liver disease model can be established, research on pharmacokinetics and medicine activity can be performed, and the micro-vessel liver chip has the advantages of using a small quantity of samples, achieving medicine low consumption and being portable, economical, efficient and accurate.

The invention relates to a packaging and interconnecting structure and method for copper protruded points filled up with double layers of underfill. The packing and interconnecting structure is characterized in that the chip end is filled up with the first layer of underfill, the first layer of underfill is manufactured on a wafer through spin coating process, the substrate end is filled up with the second layer of underfill, the substrate end is filled through capillary effects after flip-chip welding is finished, the glass transition temperature and the Young modulus of the first layer of underfill are lower than those of the second layer of the underfill, a chip and a substrate are connected through the copper protruded points and tin-contained solder protruded points to achieve high-density connection, and the copper protruded points are manufactured in twice to guarantee that the first layer underfill is completely filled and the contact between the protruded points and the tin-contained solder is enough. The whole technological process is compatible with existing IC process and has higher vertical interconnection density, better electric connection characteristics and higher mechanical stability. Heating thermal circulation tests show that the service life of chips of the packaging structures is greatly prolonged.

A multilayer wiring board (100) has a first wiring region (101) wherein a wiring (103a) and insulating layers (104a, 104b) are alternately laminated; and a second wiring region (102) wherein a thickness (H2) of an insulating layer (104) is double a thickness (H1) of an insulating layer of the first wiring region (101) or more, and a width (W2) of a wiring (103b) is double a wiring width (W1) or more. The first wiring region (101) and the second wiring region (102) are integrally formed on the same substrate.

A light detecting device for imaging comprises a plurality of light detectors (6) that are arranged on a substrate (5) one- or two-dimensionally, a low refractive index transparent layer (12) that is formed over the light detectors, and a plurality of high refractive index transparent portion (13) formed in a column-shape or a plate-like shape which are embedded in the low refractive index transparent layer along an arrangement direction of the light detectors. Two or more light detectors are arranged for one high refractive index transparent portion. When light inputted into the low refractive index transparent layer or the high refractive index transparent portion passes through these, a phase shift is caused in its wave surface and the light is separated into a 0-th order diffracted light, a 1st order diffracted light, and a -1st order diffracted light. Therefore, improvement of light use efficiency and a higher density of pixels can be realized.

The invention discloses a preparation method of a high-permeability FeNiMo magnetic powder core. The preparation method comprises the following specific operation steps: selecting water-atomized FeNiMo powder; carrying out film forming processing; carrying out insulating processing; after carrying out insulating processing on the FeNiMo powder, adding a high-temperature resistance adhesive to stir and taking out the FeNiMo powder until the FeNiMo powder is air-dried; before forming, adding a lubricant and pressing into a magnetic core after uniformly mixing; carrying out annealing thermal processing on the magnetic core in the N2 atmosphere; spraying epoxy resin paint on the magnetic core. The preparation method has the beneficial effects that by adding a right amount of high-temperature resistance insulating material, selecting a suitable insulating coating method and adopting a pressing forming and high-temperature annealing process, high density and high permeability of the FeNiMo magnetic powder core are realized; the permeability of the FeNiMo magnetic powder core can reach over 185; power loss can reach below 1,000mW / cm<3> under the testing condition of 100K / 100mT.

The present invention provides an iron-based soft magnetic powder for powder magnetic cores, which does not use rare metals, can maintain electrical insulation between iron powder particles even when heat treatment is performed at a high temperature, and has excellent thermal stability and mechanical strength. In addition, the present invention provides a method for producing the above-mentioned iron-based soft magnetic powder for powder magnetic cores and a powder magnetic core. In the iron-based soft magnetic powder for dust cores of the present invention, a phosphoric acid-based chemical conversion coating is formed on the surface of the iron-based soft magnetic powder, and a silicone resin coating is formed on the surface of the phosphoric acid-based chemical conversion coating. The phosphoric acid-based chemical conversion coating contains P, B, Mg, and Al.

An objective of the invention is to realize a circular conveying apparatus which can reduce bad conveying or conveying pollution generated with micromation of conveyed objects, and is helpful to realize high speed of conveying height or high density of conveying forms. The circular conveying apparatus (10) is provided with a recycling transfer portion (X) which makes conveyed objects excluded by a supply side arrangement path (11a) transfer to a recycling side conveying path (12a), and a supply transfer portion (Y) which makes conveyed objects conveyed by the recycling side conveying path (12a) transfer to the supply side arrangement path (11a). In the recycling transfer portion (X), a downstream end of an excluding path of the conveyed objects from the supply side arrangement path (11a) is above an upstream portion of the recycling side conveying path (12a) and hangs over, or in the supply transfer portion (Y), a downstream end of the recycling side conveying path (12a) is above an upstream portion of the supply side arrangement path (11a) and hangs over.

This electroformed metal mask for vapor deposition comprises hole inner peripheral surfaces (321S) defining mask holes (321H) each of which has a frustum shape and has a large opening (322F) as the bottom portion thereof. In a cross-section perpendicular to the front surface: a slope angle (theta) between the rear surface and a virtual straight line Li connecting the large opening (322F) to a small opening (322B) is 50-85 DEG; and the distance between the front surface and the rear surface is represented by a thickness (H), the distance, on a reference plane (Pi) which is parallel to the rearsurface and which is disposed at a distance of (2 / 3)*H from the rear surface, between the hole inner peripheral surface (321S) and the virtual straight line is represented by a recessed amount A, and0<[(3*tan[theta])*A] / H<=0.3 is satisfied.

Ordinary optical disks need the resetting of recording conditions in the course of recording to cope with changes in ambient temperature, laser temperature, and medium's recording sensitivity. Optical disks for super-resolution reproduction which are intended to reproduce record marks smaller than the optical resolution, thereby increasing the recording density, need the resetting of recording conditions as well as the condition of super-resolution reproduction because the quality of reproduced signals depends largely on the power for super-resolution reproduction. The power for recording as well as the power for super-resolution reproduction is therefore changed in the course of test recording to detect the deviation from the optimum value of the recording condition to obtain the optimum recording power. In this case, it is also desirable to change the power for super-resolution reproduction in proportion to the power for recording.

To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.

Disclosed is a laminate for flexible wiring, in which a copper plate is applied entirely or locally on a copper foil that is cladded on an insulating resin substrate, and which is characterized in that the ratio (A) of the area intensity of an X-ray peak in the X-ray diffraction on the surface of the copper plate (A = [(200) / {(111)+(200)+(220)+(311)}]100) is larger than 90. Also disclosed is a laminate for flexible wiring, in which a copper plate is applied entirely or locally on a copper foil that is cladded on an insulating resin substrate, and which has particularly high flexibility and enables the formation of fine patterns (highly dense patterns) of a wiring line.

This sample inspection device 100 is provided with at least one substrate 1 having a sample mounting face F1 provided with two or more of recesses 3 for storing independently two or more of liquid drops containing a measuring object to be analyzed. The face F1 is partitioned at least into the first area F11 coated with a hydrophobic monomolecular film 2, and the second areas F12 having an inside not coated with the monomolecular film 2 and having a hydrophilic property. A bottom face of the each of the recesses 3 is formed of the F12, and the whole outer circumferential portion including the whole inner face of the each recess 3 is formed of the monomolecular film 2 coating the F11. The film 2 is formed of an organic molecule, and is immobilized onto the face F1 with a covalent bond.

The performance of a solid state image sensor which is formed by performing divided exposure that exposes the entire chip by a plurality of times of exposure and in which each of a plurality of pixels arranged in a pixel array portion has a plurality of photodiodes is improved. In the divided exposure performed when the solid state image sensor is manufactured, a dividing line that divides an exposure region is defined to be located between a first photodiode and a second photodiode aligned in a first direction in an active region in a pixel and is defined to be along a second direction perpendicular to the first direction.

The invention discloses a micro-stirring friction welding process for electronic packaging and belongs to the technical field of electronic packaging. The problem that an existing electronic packagingtechnology is not ideal in densification and pollution freeness achieving effect and the problem that an existing stirring friction welding technology can hardly achieve direct welding on micro, small and thin structures. Firstly, a first bonding pad and a second bonding pad to be welded serve as a welding pad set; when the welding pad set is arranged at single points, a press-in hole is prefabricated and machined in a first substrate, the welding pad set is arranged between the first substrate and a second substate in parallel, the press-in hole and the center position of the welding pad setare arranged in a centering manner, and then the first substrate and the second substrate are compressed through a clamp; and a stirring head is coaxially aligned to the upper portion of the press-inhole, the stirring head is controlled to rotate at high speed and move downwards into the press-in hole and then is pressed into the first welding pad; and under the set press-in amount and holding time, the permanent metallurgy connection of the first welding pad and the second welding pad is achieved, and finally the stirring head is controlled to move out of the press-in hole upwards.

The invention relates to a no-bracket one year-one harvest one-plant one-root-tuber cultivation method for beautiful millettia roots. The no-bracket one year-one harvest one-plant one- root-tuber cultivation method comprises the following steps: carrying out field planting on beautiful millettia root seedlings in double rows in a staggered mode from every February to every March, and pruning plant vines when the plant vines of the beautiful millettia root seedlings grow to certain length to shape the beautiful millettia roots like umbrella-shaped arbuscular trees; pruning roots every June to Every August, and keeping one main root for each plant; soaking the roots of the beautiful millettia root seedlings and nutrient soil covering outside the roots in a root growth promoting agent; spraying and applying foliage fertilizer twice at each shoot adnation period. The no-bracket one year-one harvest one-plant one-root-tuber cultivation method for beautiful millettia roots provided by the invention has the advantages of being low in planting cost, short in planting period, good in root-tuber quality, high in yield, quick in investment recovery, easy to popularize, and the like.

The invention discloses a manufacturing method for a high-density cold spraying metal sedimentary body based on mixed powder and belongs to the technical field of material engineering. The method includes the following steps that firstly, conventional atomized metal powder and ionized metal powder or hydroxyl metal powder are mechanically mixed to manufacture the mixed powder, wherein the conventional atomized metal powder and the ionized metal powder or the hydroxyl metal powder adopt the same metal components; and secondly, the surface of a base body or the surface of a workpiece to be sprayed is pretreated, the mixed powder serves as spraying powder, a coating or a blocky material is deposited through a cold spraying method. By the adoption of the method, the characteristic that the deposition efficiency of the electrolyzed / hydroxyl metal powder is high is maintained, the defects that the electrolyzed / hydroxyl metal powder is pool in fluidity and prone to blocking a spray gun are overcome, pores in the deposited electrolyzed / hydroxyl metal powder are closed through the strong tamping effect generated by impact of conventional atomized powder, and the completely-dense metal sedimentary body is obtained.

The invention discloses a production process of high-density velvet. The production process comprises the following steps of interweaving warp yarns, weft yarns and pile warp yarns, cutting velvet, and carrying out after-treatment to obtain the high-density velvet. Pile heads protruding out of the base cloth are arranged between every two wefts of the prepared high-density velvet. In a first dent,one pile warp is added to two pile warps to form three pile warps, in the second dent, one pile warp is added to two pile warps to form three pile warps, and the pile warp consolidation weft of the second dent is one-weft staggered with the pile warp consolidation weft in the first dent. In this way, the pile warps in the two dents are clamped by the left ground warp and the right ground warp which are adjacent to each other, the W consolidation fastness is improved, pile roots of the pile warps are protected by the other two ground warps, and therefore although only one pile warp is additionally arranged in each dent, one pile head can be arranged between every two wefts due to the fact that the pile warps are properly added, and the velvet can truly reach high density and is deeply loved by the customer.

The invention relates to a tread pattern for a vehicle tire with radially protruding positive profiles (1) delimited by grooves (5, 6, 7, 8) - such as profiled block elements or profiled ribs - delimited in the radial direction R of the tire by a radially outer surface (13), and with mutually spaced apart, fine incisions (10) formed in the positive profiles (1), the tread pattern being characterised in that fine incisions (10) extending along their main direction of extension in the radially outer surface (13) are formed in the positive profile (1) and have first straight sections (14) - oriented, in particular, in the main direction of extension - and second sections (15) in the shape of circle segment lines,

The invention relates to a packaging and interconnecting structure and method for copper protruded points filled up with double layers of underfill. The packing and interconnecting structure is characterized in that the chip end is filled up with the first layer of underfill, the first layer of underfill is manufactured on a wafer through spin coating process, the substrate end is filled up with the second layer of underfill, the substrate end is filled through capillary effects after flip-chip welding is finished, the glass transition temperature and the Young modulus of the first layer of underfill are lower than those of the second layer of the underfill, a chip and a substrate are connected through the copper protruded points and tin-contained solder protruded points to achieve high-density connection, and the copper protruded points are manufactured in twice to guarantee that the first layer underfill is completely filled and the contact between the protruded points and the tin-contained solder is enough. The whole technological process is compatible with existing IC process and has higher vertical interconnection density, better electric connection characteristics and higher mechanical stability. Heating thermal circulation tests show that the service life of chips of the packaging structures is greatly prolonged.

The present invention provides a method for producing a magnetic disk, which is capable of forming a magnetic recording layer at high temperature. The present invention relates to a method for producing a magnetic disk, which comprises a step wherein a magnetic recording layer is formed on a glass substrate that is at a temperature of 550 DEG C or more, and in which the glass substrate contains, in mol%, 60-75% of SiO2, 7-17% of Al2O3, 0% or more but less than 2% of B2O3, and one or more substances selected from among MgO, CaO, SrO and BaO in an amount of more than 18% but 26% or less in total, with the total of the above-mentioned seven components being 95% or more, while containing one or more substances selected from among Li2O, Na2O and K2O in an amount of less than 1% or not containing any of these three substances.

The invention provides a device comprising nanowires and a production method of the device. The production method comprises the steps of (S1) providing a substrate with grooves; (S2) filling the grooves with an insulating material to form insulating parts, wherein the grooves correspond to the insulating parts one by one; and (S3) etching to remove parts of the substrate at two sides of the insulating parts, forming a plurality of stacked nanowires by the remaining substrate located at two side walls of the insulating parts and forming a first substrate body by the remaining substrate outsidethe nanowires, wherein the insulating parts are located on the surface of the first substrate body. The nanowires formed by using the production method are relatively perfect in lattices and the performance of the device is relatively good; and furthermore, according to the production method, the nanowires are attached to the insulating parts, that is to say, the insulating parts provide the nanowires with support, so that the nanowires can be produced very long and thin, the fracture problem is avoided and high density of the nanowires can be achieved.

The invention relates to a tread pattern for a vehicle tire with radially protruding positive profiles (1) delimited by grooves (5, 6, 7, 8) - such as profiled block elements or profiled ribs - delimited in the radial direction R of the tire by a radially outer surface (13), and with mutually spaced apart, fine incisions (10) formed in the positive profiles (1), the tread pattern being characterised in that fine incisions (10) extending along their main direction of extension in the radially outer surface (13) are formed in the positive profile (1) and have first straight sections (14) - oriented, in particular, in the main direction of extension - and second sections (15) in the shape of circle segment lines.

The invention relates to a winding, a stator and a motor. The winding comprises: a plurality of coils; each coil comprises a double-layer conductor module, a first conductor and a connecting conductormodule; the double-layer conductor module is connected with the first conductor through the connecting conductor module; the double-layer conductor module comprises a second conductor and a third conductor; and the connection conductor module comprises a first connection conductor and a second connection conductor. The second conductor and the third conductor are vertically arranged side by side,the output end of the second conductor is connected with the input end of the first conductor through the first connecting conductor, and the output end of the first conductor is connected with the input end of the third conductor through the second connecting conductor. According to the invention, the second conductor and the third conductor are arranged side by side up and down, so that the twoconductors have a capacitance effect under high-frequency pulse potential excitation, the loss is reduced when current flows through the conductors, the electrical load density of the motor can be improved, and the high density of the motor is realized.

The imaging device includes a solid-state imaging element and a substrate. The solid-state imaging device has a pixel array in which a plurality of pixels are arranged in a two-dimensional matrix, and pads ( 51 ) provided corresponding to pixel columns of the pixel array and outputting signals of pixels in the pixel column. A signal output terminal group having a plurality of pads (51) arranged in a line along the column direction of the pixel array is arranged along the row direction of the pixel array. The substrate ( 6 ) has laminated wiring for each signal output terminal group, and the laminated wiring is formed by stacking a plurality of wiring layers extending in the column direction of the pixel array. The laminated wiring (32) includes a first terminal portion (61) provided at a position facing each pad (51) of the signal output terminal group. The pad (51) is connected to the first terminal portion (61) via the pad (9).

The invention discloses a micro-vessel liver chip based on cell clusters. The micro-vessel liver chip comprises a micro-vessel system located on the upper layer, a blood-vessel-endothelium-like barrier system in the middle and a liver-organ multi-cell co-culture system on the lower layer, wherein the micro-vessel system and the liver-organ multi-cell co-culture system are arranged on own substrates respectively. The micro-vessel system comprises a bent vessel composed of multiple flow-stopping barriers in a staggered mode, and a micro-vessel inlet and a micro-vessel outlet are formed in the two ends of the bent vessel respectively. The blood-vessel-endothelium-like barrier system is composed of a porous film. The liver-organ multi-cell co-culture system comprises a cell cluster enrichment region and a multi-cell co-culture region, and a culture system inlet and a culture system outlet are formed in the two ends of the liver-organ multi-cell co-culture system respectively. A liver disease model can be established, research on pharmacokinetics and medicine activity can be performed, and the micro-vessel liver chip has the advantages of using a small quantity of samples, achieving medicine low consumption and being portable, economical, efficient and accurate.

The invention relates to a terminal mounting structure, a cable connector and a connector assembly. The terminal mounting structure comprises an insulator seat (51) andterminal assemblies. The terminal assemblies are installed in the insulator seat in a row mode, each terminal assembly comprises paired signal terminals (61) and grounding terminals (62), the paired signal terminals form a differential signal pair (63), and the differential signal pair (63) is arranged between the grounding terminals (62); one end, extending out of the insulator seat, of the terminal assembly is an elastic contact area (601), and the other end of the terminal assembly is a wiring area (603) connected with a cable; and the insulator seat (51) is provided with at least two rows of terminal assemblies at intervals in the front-back direction. By means of the technical scheme, the terminals are arranged in rows and assembled on the front row and the rear row of the insulator seat respectively, the high-speed transmission performance is improved, and meanwhile the size of the connector can be effectively reduced.