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Method of manufacturing circuit device

A manufacturing method and circuit device technology, which can be applied in circuit devices, printed circuit manufacturing, circuits, etc., can solve problems such as miniaturization of difficult circuit devices, and achieve the effects of improved weight reduction, improved heat dissipation, and reduced manufacturing processes

Inactive Publication Date: 2006-02-01
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to miniaturize the circuit device

Method used

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  • Method of manufacturing circuit device
  • Method of manufacturing circuit device

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Experimental program
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Effect test

no. 1 approach

[0029] refer to figure 1 and figure 2 A method of manufacturing the circuit device according to the first embodiment will be described.

[0030] First, refer to figure 1 (A), the conductive foil 13 is pasted on the support substrate 11 via the adhesive 12 . The material of the conductive foil 13 is selected in consideration of solder adhesion, bonding, and plating properties. As a specific material, a conductive foil made of Cu as a main raw material, a conductive foil made of Al as a main raw material, or a conductive foil made of an alloy such as Fe—Ni, or the like is used. In addition, other conductive materials are also possible, and etchable conductive materials are particularly preferred. The thickness of the conductive foil 13 is about 10 μm to 300 μm. However, a conductive foil of 10 μm or less or 300 μm or more may be used.

[0031] As the adhesive 12, a thermoplastic resin, a UV sheet (substance that loses adhesiveness by irradiating ultraviolet rays), or th...

no. 2 approach

[0050] refer to Figure 3 ~ Figure 5 A method of manufacturing the circuit device according to the second embodiment will be described. The basic steps of the manufacturing method of the circuit device of this embodiment are the same as those of the first embodiment. Therefore, a description will be given here centering on the differences.

[0051] First, refer to image 3 (A), the protrusions 18 are formed on the first conductive film 33 bonded with the adhesive 12 on the support substrate 11 . The first conductive film 33 is half-etched using the resist 14 as a mask to form the protruding portion 18 which is a thick portion and a thin portion. After the protrusions 18 are formed, the resist 14 is removed.

[0052] refer to image 3 (B), same as the previous embodiment, etch the thin part to form a thick conductive pattern and a thin conductive pattern. Here, the resist 14 is patterned so as to cover a region wider than the region of the convex portion 18 . Then, wet e...

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PUM

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Abstract

To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.

Description

technical field [0001] The present invention relates to a method for manufacturing a circuit device, and more particularly to a method for manufacturing a circuit device that realizes a thin circuit device. Background technique [0002] Along with miniaturization and higher functionality of electronic equipment, miniaturization and higher density are also required in circuit devices used therein. refer to Figure 9 An example of a conventional method for manufacturing a circuit device will be described (see Patent Document 1). [0003] First, refer to Figure 9 (A) The contact hole 103 is formed on the substrate 101 made of an insulating material such as resin by using a laser or the like. Then, plating films 102 are formed on both surfaces of the substrate 101 including the inside of the contact hole 103 . [0004] Second, refer to Figure 9 (B), by etching the plating film 102, a first conductive pattern 102A is formed on the surface of the substrate 101, and a second co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50
CPCH01L2924/19105H05K3/4647H01L2924/01046H05K1/187H01L2221/68345H01L23/3128H05K2201/09509H01L2224/32245H05K3/4682H05K2201/0209H05K2201/09563H01L23/49816H01L2924/15311H01L2924/01029H01L2924/19041H01L2224/48091H05K2203/0152H01L21/568H01L2924/01013H05K1/0265H01L2224/32225H05K3/4652H05K2203/1476H05K3/4658H05K3/06H01L24/48H01L2924/01079H01L2224/48465H05K1/185H01L2224/48247H05K2201/09736H05K3/423H01L2924/01078H01L21/4857H01L2224/73265H01L2224/85001H05K2203/0369H05K3/20H01L2924/13055H01L2924/1301H01L2924/13034H01L2924/1305H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207H01L23/02
Inventor 高草木贞道五十岚优助根津元一草部隆也
Owner SANYO ELECTRIC CO LTD
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