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Terminal manufacturing method and terminal and electronic component core body manufacturing method

A technology of electronic components and manufacturing methods, which is applied to the production of terminals and their electronic component cores, and the field of terminal production of electronic components, and can solve the problems of increasing terminal manufacturing costs, large metal waste, and waste of metal sheets

Active Publication Date: 2015-11-25
SHIN YUAN ELECTRONICS PROD KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the manufacturing method of the above-mentioned electronic component core and its terminals, the metal sheet base material is generally copper metal material. Since the terminals are directly stamped and formed by the metal sheet, a large amount of metal waste is generated when stamping the terminals, thereby increasing the number of terminals. manufacturing cost
combine Figures 1 to 2 It can be seen that in the above-mentioned manufacturing method, the area of ​​the metal sheet occupied by each group of terminals is far smaller than the area of ​​the metal scrap produced after stamping the terminal, thus causing a large amount of metal sheets to be wasted, thus increasing the production time of electronic components. Core and Terminal Production Costs

Method used

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  • Terminal manufacturing method and terminal and electronic component core body manufacturing method
  • Terminal manufacturing method and terminal and electronic component core body manufacturing method
  • Terminal manufacturing method and terminal and electronic component core body manufacturing method

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Embodiment 1

[0038] Figure 4 -10 is a schematic diagram of the terminal manufacturing method of the present invention, please refer to Figure 4 , the coil inductance in the surface mount device of this embodiment is taken as an example to illustrate the terminal manufacturing method of the embodiment of the present invention. A terminal manufacturing method, comprising the following steps:

[0039] Step S1, please refer to Figure 5 and 6 , providing a rectangular metal sheet 200, and a strip-shaped plastic sheet substrate 100 whose price is lower than the metal sheet 200;

[0040] Step S2, please refer to Figure 7 , dividing the length of the base material 100 into several rectangular stamping areas 101 of equal size, so that the area of ​​the stamping area 101 is larger than the area of ​​the metal sheet 200;

[0041] Step S3, please refer to Figure 9 One of the metal sheets 200 is correspondingly and fixedly arranged on one of the punching areas 101 of the substrate 100, so th...

Embodiment 2

[0052] The second embodiment is improved on the basis of the first embodiment, and the steps of the terminal manufacturing method are the same as those of the first embodiment. The second embodiment provides a method for manufacturing the core body of an electronic component and its terminals, please refer to Figure 11 , including the following steps:

[0053] Step S1, please refer to Figure 5 and 6 , providing a rectangular metal sheet 200, and a strip-shaped plastic sheet substrate 100 whose price is lower than the metal sheet 200;

[0054] Step S2, please refer to Figure 7 , dividing the length of the base material 100 into several rectangular stamping areas 101 of equal size, so that the area of ​​the stamping area 101 is larger than the area of ​​the metal sheet 200;

[0055] Step S3, please refer to Figure 9 One of the metal sheets 200 is correspondingly and fixedly arranged on one of the punching areas 101 of the substrate 100, so that the length direction of t...

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Abstract

PROBLEM TO BE SOLVED: To provide a terminal manufacturing method and a manufacturing method for an electronic component core and its terminal.SOLUTION: A terminal manufacturing method includes: a step S1 preparing a metal piece and a base material; a step S2 which divides the base material into a plurality of press areas; a step S3 for fixing one metal piece in correspondence with any press area of the base material; a step S4 which forms two terminals where metal pieces are placed vertically opposite in the base material by pressing the metal piece and the base material. Also, in addition to the steps S1 to S4, a manufacturing method for an electronic component core and its terminal further includes: a step which solders the electronic component core in correspondence with the terminal; a step which cuts the terminal fixed to the base material and takes out the connected electronic component core and terminal; and a step which exposes a part of each terminal to a side surface or a bottom part of a package housing by performing packaging by a package process.

Description

technical field [0001] The invention relates to a method for manufacturing electronic components, in particular to a method for manufacturing terminals of electronic components and a method for manufacturing terminals and cores of electronic components. Background technique [0002] Electronic components, including plug-in devices and surface mount devices, are generally composed of electronic component cores, terminals connected to the electronic component cores, and packaging shells. Wherein, a terminal is also called an electrode sheet, and is also called a pin. Among them, the electronic components may be surface mount coil inductors, capacitors, ballasts, diodes and other components. When the electronic component is a coil inductor, its core is a coil; when the electronic component is a ballast, its core is a ballast coil; when the electronic component is a capacitor, its core is a capacitor Pole plate; when the electronic component is a semiconductor diode, its core ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/16H01F27/29H01F41/04
CPCH01L2224/97
Inventor 钟宗原
Owner SHIN YUAN ELECTRONICS PROD KUNSHAN