Low-temperature sintering microwave dielectric ceramic Ca3Bi(PO4)3 and preparation method thereof

Abstract

The invention discloses a low-temperature sintering microwave dielectric ceramic Ca3Bi(PO4)3 and a preparation method thereof. The composition formula of the low-temperature sintering microwave dielectric ceramic is Ca3Bi(PO4)3. The preparation method comprises the steps of (1) weighing and batching original powder of CaCO3, Bi2O3 and P2O5 with the purity being over 99.9% according to the chemical formula Ca3Bi(PO4)3; (2) carrying out wet ball-milling and mixing on raw materials obtained in the step (1) for 12 hours, taking distilled water as a solvent, drying, and then, pre-sintering in an air atmosphere for 6 hours at the temperature of 750 DEG C; (3) adding a binder into powder prepared in the step (2), granulating, then, carrying out compression molding, and finally, sintering in the air atmosphere for 4 hours at the temperature of 840-870 DEG C, wherein a polyvinyl alcohol solution with the mass concentration of 5% is adopted as the binder, and the dosage of the binder accounts for 3% of the total mass of the powder. According to the ceramic prepared by the preparation method, the sintering at the temperature of 840-870 DEG C is good, the dielectric constant reaches 19-20, the quality factor (Qf) reaches up to 74,000-93,000GHz, and the temperature coefficient of resonance frequency is small, so that the ceramic has a great application value in industries.

Description

technical field [0001] The invention relates to a dielectric ceramic material, in particular to a microwave dielectric ceramic material for microwave components used at microwave frequencies, such as a dielectric substrate, a resonator, and a filter, and a preparation method thereof. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials in circuits in the microwave frequency band (mainly UHF and SHF bands) and perform one or more functions. They are widely used as resonators, filters, and dielectric substrates in modern communications. Components such as chips and dielectric waveguide circuits are the key basic materials of modern communication technology. They have been used in portable mobile phones, car phones, cordless phones, TV satellite receivers and military radars. They are used in modern communication tools. It is playing an increasingly important role in the process of miniaturization and integration. ...

AI Technical Summary

Problems solved by technology

In recent years, with the development of low temperature co-fired ceramics (Low Temperature Co-fired Ceramics, LTCC) and the requirements of the development of microwave multilayer devices, researchers at home and abroad have carried out extensive exploration and research on some low-temperature co-fired materials, mainly The glass-ceramic or glass-ceramic composite material system is used. Because the low melting point glass phase has relatively high dielectric loss, the existence of the glass phase greatly improves the dielectric loss of the material.

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