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Cup-shaped heat dissipater having flow guide hole annularly arranged at the bottom periphery and applied in electric luminous body

A heat sink and luminous body technology, which is applied in semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, light sources, etc., can solve problems such as limited heat dissipation area

Inactive Publication Date: 2014-02-12
杨泰和
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditionally applied to the heat sink of the electric energy luminous body 200 of the electric lighting device, such as the heat sink of the light-emitting diode LED lighting device, the heat energy generated by the LED is usually transmitted to the heat sink and then dissipated from the surface of the heat sink, and the heat dissipation area is relatively limited. limit

Method used

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  • Cup-shaped heat dissipater having flow guide hole annularly arranged at the bottom periphery and applied in electric luminous body
  • Cup-shaped heat dissipater having flow guide hole annularly arranged at the bottom periphery and applied in electric luminous body
  • Cup-shaped heat dissipater having flow guide hole annularly arranged at the bottom periphery and applied in electric luminous body

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Embodiment Construction

[0089] The present invention is aimed at the heat dissipation requirements of the electric light emitter, for example, when using a light emitting diode (LED) as the heat dissipation of the electric light emitter 200, it is the first to create a cup-shaped heat sink with diversion holes, and the outer and / or inner surface of the cup-shaped heat sink 100 , for the installation of the electric energy luminous body 200, the heat energy generated by the electric energy luminous body 200 is dissipated externally by the surface of the heat sink 100, and further increased by the back-to-cup-shaped concave structure of the heat sink 100 for the electric energy luminous body 200 The heat dissipation surface forms a large heat dissipation area to directly dissipate heat, and further sets a diversion hole for the airflow through the radiator 100. The location of the diversion hole includes one or more of the following, including: (1) set in a The bottom surface 120 of the cup of the heat ...

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Abstract

The present invention provides a novel cup-shaped heat dissipator (100) having an outer and / or inner surface served for accommodating the electric luminous body (200), so the heat can be dissipated to the exterior from the surface of the heat dissipator (100), and with the enlarged heat dissipation surface formed in the cup-shaped inner recessed structure of the heat dissipator (100) opposite to the installation location of the electric luminous body (200), the heat can also be directly dissipated through the larger heat dissipation area. Furthermore, flow guide holes (301,303,304) allowing airflow to pass are formed on the heat dissipator (100) for performing heat dissipating convection.

Description

technical field [0001] The present invention is aimed at the heat dissipation requirements of the electric light emitter, for example, when using a light emitting diode (LED) as the heat dissipation of the electric light emitter 200, it is the first to create a cup-shaped heat sink with diversion holes, and the outer and / or inner surface of the cup-shaped heat sink 100 , for the installation of the electric energy luminous body 200, the heat energy generated by the electric energy luminous body 200 is dissipated externally by the surface of the heat sink 100, and further increased by the back-to-cup-shaped concave structure of the heat sink 100 for the electric energy luminous body 200 The heat dissipation surface forms a larger heat dissipation area to directly dissipate heat, and the heat dissipation body 100 is further provided with guide holes for air flow to conduct convective heat dissipation through the heat dissipation fluid. Background technique [0002] Traditional...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02
CPCF21V29/242F21V29/225F21V29/2275F21V29/004F21V29/2262F21V29/246F21V29/2293F21Y2101/02F21V29/75F21V29/763F21V29/80F21V29/83F21V29/86F21V29/89F21Y2115/10
Inventor 杨泰和
Owner 杨泰和