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Method of manufacturing composite circuit board with built-in spacers

一种定位件、线路板的技术，应用在印刷电路制造、多层电路制造、用电元件组装印刷电路等方向，能够解决复合线路板易发生弯曲、生产率或可靠性恶化、精准度不确实等问题

Inactive Publication Date: 2016-06-15
BRIDGE SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the composite circuit board has an asymmetric structure and the thermal expansion coefficient of the interposer is different from that of the build-up circuit, the composite circuit board is prone to bending, resulting in the situation that the interposer cannot be equipped with a low-k value semiconductor chip
In addition, when the interposer needs to be placed on the circuit before the highly precise conductive blind vias that form the internal connections, if the accuracy of the placement of the interposer is inaccurate, or the die attach under the interposer will "re-apply" when it cures. flow”, it is impossible to align the laser beam to the contact pad, thus, it may lead to deterioration of productivity or reliability

Method used

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  • Method of manufacturing composite circuit board with built-in spacers
  • Method of manufacturing composite circuit board with built-in spacers
  • Method of manufacturing composite circuit board with built-in spacers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] figure 1 and figure 2 is a cross-sectional view of a method for forming a spacer on a dielectric layer according to an embodiment of the present invention, and Figure 2A for figure 2 top view.

[0056] figure 1 It is a cross-sectional view of a laminated structure including a metal layer 11 , a dielectric layer 21 , and a support plate 23 . The metal layer 11 shown in the figure is a copper layer with a thickness of 35 μm, however, the metal layer 11 can also be various metal materials, and is not limited to the copper layer. In addition, the metal layer 11 can be deposited on the dielectric layer 21 by various techniques, including lamination, electroplating, electroless plating, evaporation, sputtering, and combinations thereof to deposit a single-layer or multi-layer structure, and its The thickness is preferably in the range of 10 to 200 microns.

[0057] The dielectric layer 21 is generally made of epoxy resin, glass epoxy resin, polyimide, and the like, a...

Embodiment 2

[0080] Figure 11 and Figure 11A Each is a cross-sectional view and a top view of the structure of the composite circuit board 102 according to another embodiment of the present invention, which includes a configuration guide 115 near the peripheral edge of the reinforcement layer 41 and an additional first conductive blind hole 243 , which directly contacts the reinforcement layer 41 .

[0081] In this embodiment, the composite wiring board 102 is manufactured in the same manner as described in Embodiment 1, except that by removing selected portions of the metal layer 11, the positioning guide 115 is formed simultaneously during the formation of the spacer 113 to accurately The position of the strengthening layer 41 is defined, and an additional first conductive blind hole 243 is formed, which directly contacts the strengthening layer 41 . The configuration guide 115 extends from the first insulating layer 211 in the upward direction beyond the attachment surface of the rei...

Embodiment 3

[0083] Figure 12-Figure 16 It is a cross-sectional view of a method for preparing a composite circuit board for an LED module according to yet another implementation aspect of the present invention.

[0084] For the purpose of brevity, any statement in Example 1 may be incorporated into the same application section here, and the same statement will not be repeated.

[0085] Figure 12 for Figure 1-Figure 3 Sectional view of the structure prepared by the steps shown. In this embodiment, in addition to the first contact pad 312 , the second contact pad 314 , and the through hole (not shown), the interposer 113 further includes a heat dissipation pad 316 located on the first surface 311 .

[0086] Figure 13 It is a cross-sectional view of the structure on which the protective film 71 is attached and the support plate 23 is thinned. The protective film 71 covers the interposer 31 , the positioning member 113 and the dielectric layer 21 in an upward direction. After provid...

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PUM

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Abstract

The invention relates to a method for manufacturing a composite circuit board with a built-in positioning part and an intermediate layer. According to a preferred implementation aspect of the present invention, the method includes: forming a positioning member on a dielectric layer; using the positioning member as a configuration guide, disposing an interposer on the dielectric layer; attaching a reinforcing layer to the dielectric layer; and forming a build-up circuit that covers the interposer, the spacer and the stiffener and provides signal routing for the interposer. Accordingly, the positioning member can accurately define the placement position of the interposer, so as to avoid electrical connection errors between the interposer and the build-up circuit.

Description

technical field [0001] The invention relates to a method for manufacturing a composite circuit board, in particular to a method for manufacturing a composite circuit board with a built-in positioning part and an intermediary layer. Background technique [0002] The conventional flip-chip package includes a flipped semiconductor chip, which is connected to a laminated substrate through an array of solder bumps. Generally, the pitch of the matching contact pads on the laminated substrate is finer than that of the backside contact pads. The laminated substrate can accommodate chips with high I / O value, and the packaged components can be easily attached to the printed circuit board of the next layer of components. In order to meet finer functions and higher performance requirements, modern semiconductor chips use low-k value dielectric materials as interlayer materials. When the low-k dielectric material is porous, brittle, and very sensitive to interface stress, traditional fl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH01L24/19H01L2224/16145H01L2224/16225H01L2224/73259H01L2224/8314H01L2224/92144H01L2224/45144H05K1/183H05K3/4644H05K2201/09781H05K2201/10378H05K2201/10674H05K2201/2009H05K2203/1469H05K2203/167H01L2924/12042Y10T29/4913H01L2924/3511H01L2924/00H05K3/30
Inventor 林文强王家忠
Owner BRIDGE SEMICON