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Bumpers in vacuum cups for absorbing objects to be handled

A technology of vacuum suction cups and buffer sheets, applied in the field of buffer sheets, can solve the problems of insufficient antistatic, expensive ventilation performance of polyethylene film, etc., achieve excellent antistatic effects and reduce costs

Active Publication Date: 2016-10-05
TOP NANOSYS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional buffer sheets have approximately 10 10 ohm / sq resistance, which is not enough antistatic
In addition, polyethylene film is expensive and has low ventilation performance

Method used

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  • Bumpers in vacuum cups for absorbing objects to be handled
  • Bumpers in vacuum cups for absorbing objects to be handled
  • Bumpers in vacuum cups for absorbing objects to be handled

Examples

Experimental program
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Effect test

Embodiment Construction

[0026] Various example embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some example embodiments are shown.

[0027] figure 1 is a cross-sectional view of a buffer sheet 100 of a vacuum chuck for supporting a workpiece according to an exemplary embodiment of the present inventive concept. as in figure 2 As shown in , the buffer sheet 100 includes a non-woven sheet 110 and an ESD coating 130 .

[0028] The buffer sheet 100 is bonded to the upper surface of the vacuum chuck 3 that fixes the work by supporting. The workpiece is set on the buffer sheet 100 . Vacuum chucks exhibit support and fixation in precise cutting operations or precise coating operations for glass substrates or semiconductor wafers used in liquid crystal displays, and in bonding operations for polarizing plates and retardation plates, or those plates with glass substrates Artifact functionality.

[0029] The nonwoven fabric sheet 110 is a mat-sha...

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PUM

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Abstract

Disclosed is a buffer sheet used in a vacuum suction cup for absorbing objects to be processed. The buffer sheet of the present invention is bonded to the upper surface of a vacuum chuck that absorbs and fixes an object to be processed, and includes a non-woven sheet and an ESD coating containing carbon nanotubes on the non-woven sheet to allow the object to be processed to be mounted. According to the present invention, since the ESD coating including carbon nanotubes having conductivity is applied, the antistatic effect is excellent.

Description

technical field [0001] Embodiments relate to a cushion sheet, and more particularly, to a cushion sheet for a vacuum chuck used to support a workpiece in a flat display panel, a semiconductor wafer, or the like. Background technique [0002] In general, the position of the glass substrate can be fixed without movement in a precise cutting operation or a precise painting operation for a glass substrate used in a display device (widely used in notebook computers, desktop computers, and televisions). In addition, it is possible to fix the position of the semiconductor wafer without moving it during a precise cutting operation or a precise coating operation on the semiconductor wafer. [0003] Vacuum supported methods are generally used to hold workpieces such as glass substrates or semiconductor wafers. The method is to use the vacuum chuck 3 as will be in figure 1 Fix the workpiece by means of vacuum support as shown in 4. Here, a ventilation hole 1 is formed on the surface...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687H01L21/683C08J5/18B23Q3/08G02F1/13
CPCB23Q3/088G02F1/1303H01L21/6838C08J5/18G02F1/13H01L21/687
Inventor 李在德崔日焕金承烈
Owner TOP NANOSYS