A New Type of Thermal Conduction and Insulation Structure

Abstract

The invention discloses a novel thermally conductive and insulating structure comprising a heat source contact layer, a thermally conductive and insulating layer, an intermediate connection layer and a rapid cooling layer; the thermally conductive and insulating layer is disposed between the heat source contact layer and the intermediate connection layer; and the rapid cooling layer is welded to the lower surface of the intermediate connection layer. Through the above manner, the novel thermally conductive and insulating structure provided by the invention can be directly welded on an external heat source for use, with more direct thermal conduction; by employing modified insulating grapheme, the thermally conductive and insulating layer not only has a good insulating effect, but also improves the plane thermally conductive performance of composite materials and has small thermal resistance; and thus, the novel thermally conductive and insulating structure is more uniform and rapid in thermal conductivity, good in cooling effect, good in protection of the external heat source and high in safety.

Description

technical field [0001] The invention relates to the technical field of heat conduction, in particular to a novel heat conduction and insulation structure. Background technique [0002] With the development of modern science and technology, the functions of various smart devices are becoming more and more powerful, and the volume is getting smaller and smaller. The compact appearance is easy to install and carry, which has brought great changes to people's production and life. If the volume is too small, the heat generated by the internal components cannot be transferred out in time, which may easily lead to a decline in equipment performance or damage, or even an explosion. It can be said that the heat dissipation problem is puzzling the further development of intelligent equipment. [0003] Existing heat dissipation methods generally include air cooling, liquid cooling, etc., all of which expand local heating to a larger space and take away heat through air or liquid. For...

AI Technical Summary

Problems solved by technology

For example, the common finned heat sinks used on the surface of various electronic devices use many aluminum or copper sheets to take away the heat emitted by the devices, but the thermal conductivity of metal materials is limited, such as the thermal conductivity of copper is 377W / m K, aluminum is 230W / m·K), and the metal is a conductor, and the aluminum sheet or copper sheet may cause a short circuit and other dangers while dissipating heat from the charged device

If the heat conductor is insulated, it will increase the thermal resistance and reduce the thermal conductivity

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