Bare die discharging device
A technology for discharging devices and bare cores, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems such as the reduction of the operating rate of bare core bonding facilities, and achieve the effect of time reduction.
Active Publication Date: 2014-03-26
SEMES CO LTD
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Problems solved by technology
[0005] On the other hand, when replacing the ejection unit and carrier to correspond to the size of the die, since a considerable amount of time is spent on calibrating the rotation angle and positioning the center of the ejection unit and carrier, die bonding using a die ejector Facility operating rates become significantly lower
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[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, and thus can be embodied in various forms. The following embodiments are provided to enable those skilled in the art to fully understand the scope of the present invention, not to complete the present invention perfectly.
[0033] When it is described that an element is disposed on or connected to another element or layer, the element can be directly disposed on or directly connected to the other element or the other element or layer can be disposed therebetween. Differently, when it is described that an element is directly disposed on or directly connected to another element, there are no other elements present. To describe various elements, components, regions, layers, and / or sections, the terms first, second, third, etc. may be used. However, the elements, compone...
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The invention discloses a bare die discharging device used for discharging a bare die out of a cutting belt. The bare die discharging device comprises a discharging unit used for selectively lifting one bare die to discharge the bare die, a bracket used for accommodating the discharging unit therein, a drive unit and a main body. The bracket is composed of at least one through hole and a shell provided with a lower opening, wherein the discharging unit is enabled to move vertically an upper panel through the through hole and the shell extends downwards from the upper panel. The drive unit is connected with the discharging unit and moves the discharging unit in the vertical direction. The main body is inserted into the lower opening of the bracket to accommodate the drive unit. In this case, the bracket and the main body are mutually connected by utilizing the magnetic force.
Description
technical field [0001] Embodiments of the present invention relate to a die ejection device, and more particularly, to a device for separating a die including a semiconductor device from a wafer and bonding the die to a substrate during a semiconductor manufacturing process. Bare die ejection device. Background technique [0002] In general, a semiconductor device can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor devices formed as described above can be separated by a dicing process and can be bonded to a substrate by a bonding process. [0003] The apparatus for performing the die bonding process may include a pick-up module that picks up and separates the die from a wafer (separated into dies containing semiconductor devices) and a bonding module that picks up the semiconductor The device is attached to the substrate. The pick module may include a stage unit that supports a ...
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Login to View More IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/6835H01L2221/68327H01L21/67132H01L21/67144H01L21/67712H01L21/67721H01L21/67754H01L21/6838
Inventor 李喜澈林锡泽
Owner SEMES CO LTD