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Device and method for producing wafer blocks

A technology of wafer sheet and transportation device, which is applied in the field of manufacturing and filling, and can solve problems such as high waste products

Active Publication Date: 2017-03-01
HAAS FOOD EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The edges must then be processed or cut off, which in turn leads to higher rejects

Method used

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  • Device and method for producing wafer blocks
  • Device and method for producing wafer blocks
  • Device and method for producing wafer blocks

Examples

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Embodiment Construction

[0014] The invention is explained in detail below with the aid of some examples.

[0015] figure 1 The device according to the invention is shown in a schematic sectional illustration with a first transport device 1 on which the wafer block components are transported along a transport surface 30 in the direction of the stacking area 8 . Arranged in the stacking area 8 is a movable gripping device 4 which undertakes important parts of the method, such as stacking, pressing, lifting, lowering, etc. The gripping device 4 includes a gripper 5 . In this embodiment, the holder 5 is designed as a vacuum plate and has a vacuum line 9 , a vacuum pump 10 and an air filter for protecting the vacuum pump 10 on its side facing away from the first transport device 1 . Device 31. The gripper 5 has an opening or a cavity on the side facing the first transport device, which can be at least partially closed by the sucked wafer sheet, more precisely the sucked first wafer block component 2 . ...

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PUM

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Abstract

A device and a method for producing multilayer wafer blocks filled with a coating material, such as cream, in which a first wafer block component (2) is transported along a conveying surface (30) to a stacking area ( 8), where the first wafer block component is lifted from the conveying surface (30) by the gripping device (4), wherein immediately or simultaneously the second wafer block component (3) is moved along the conveying surface (30) transport to the stacking area (8), and wherein the first wafer block component (2) is placed and / or pressed onto the second wafer block component (3) from above during the joining process .

Description

technical field [0001] The invention relates to a device and a method for producing multilayer wafer blocks filled with a coating material, such as cream, in which a first wafer block component is transported along a conveying surface to a stacking area, Here, the first wafer block component is lifted by the gripping device from the conveying surface, wherein immediately or simultaneously the second wafer block component is transported along the conveying surface to the stacking area. Background technique [0002] Methods and devices for producing cream-filled multilayer wafer blocks are already known and disclosed in various embodiments. [0003] For example, a method is known in which creamed wafer sheets are transported in a first plane to a stacking station, where the wafer sheets are lifted into a second plane and attached from below. to the raised part of the wafer block, wherein each coated wafer sheet is first pushed under the part of the wafer block that remains in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A21C15/02
CPCA21C15/02Y10T29/49826A23G9/286B23P19/04B65G57/301
Inventor J.哈亚斯K.哈德雷S.吉拉斯辰克J.雷斯纳L.希伊斯贝尔G.舒雷特纳
Owner HAAS FOOD EQUIP
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