Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chemical solution recycling device suitable for square substrate

A recovery device and chemical liquid technology, which is applied in the field of chemical liquid recovery devices, can solve the problems of chemical liquid pollution, dilution, and inability to reuse, and achieve the effects of rapid response, simple structure, and convenient installation

Active Publication Date: 2014-04-16
SHENYANG KINGSEMI CO LTD
View PDF7 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the chemical liquid cannot be reused due to contamination and dilution during the recovery process when processing square substrates, the purpose of the present invention is to provide a chemical liquid recovery device suitable for square substrates

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical solution recycling device suitable for square substrate
  • Chemical solution recycling device suitable for square substrate
  • Chemical solution recycling device suitable for square substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0022] Such as figure 1 , figure 2 As shown, the present invention includes a square base plate 1, a chip holder 2, a CUP 3, a liquid receiving tank 5, a cylinder 7, a motor 8 and a table panel 14, wherein the liquid receiving tank 5 is fixed on the upper surface of the table panel 14, and the liquid receiving tank 5 The bottom surface of the bottom surface extends axially upwards, forming a hollow first protrusion 18 and a second protrusion 19 from the inside to the outside. The first protrusion 18 is located in the center of the liquid receiving tank 5, the central axis and the central axis of the liquid receiving tank 5 Collinear, the second protrusion 19 is located at the periphery of the first protrusion 18, and is concentrically arranged with the first protrusion 18, and an inner groove 17 is formed between the first protrusion 18 and the second protr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the field of semiconductor industry wafer wet processing, and particularly relates to a chemical solution recycling device suitable for a square substrate. The chemical solution recycling device comprises a piece bearing platform for fixing and rotating the square substrate, a CUP, a solution containing groove, an air cylinder, a motor and a deck plate, the solution containing groove is formed in the deck plate, the piece bearing platform driven by the motor is arranged inside the solution containing groove, the square substrate is located on the piece bearing platform, any two opposite corners of the square substrate are positioned through blocking columns on the piece bearing platform, the CUP driven by the air cylinder to ascend and descend is arranged between the solution containing groove and the piece bearing platform, the solution containing groove is divided into an outer groove body for recycling the chemical solution and an inner groove body for recycling the cleaning solution through the CUP, and each groove body is provided with a drainage port. The piece bearing platform is provided with the blocking columns for positioning the square substrate, and the chemical solution can flow down along the four edges of the square substrate and can be recycled in a classified mode. The separation between the chemical solution and the cleaning solution can be controlled by through the ascending and descending of the CUP, the chemical solution is recycled through different channels, and the pollution and the dilution problems of the chemical solution are reduced.

Description

technical field [0001] The invention belongs to the field of wafer wet processing in the semiconductor industry, in particular to a chemical liquid recovery device suitable for square substrates. Background technique [0002] At present, chemical liquids are often used in the wafer wet processing process in the semiconductor industry, and how to realize the non-polluting and non-diluted recovery and reuse of chemical liquids is an inevitable problem. In the prior art, it is difficult to recover the chemical liquid, which is likely to cause the chemical liquid to be polluted and diluted, and it is more difficult to process and recycle the chemical liquid for the square substrate. Therefore, how to avoid contamination and dilution of the chemical solution during the recycling process after processing the square substrate has become an urgent problem to be solved. Contents of the invention [0003] In order to solve the problem that the chemical liquid cannot be reused due t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/306
CPCH01L21/67017H01L21/68785
Inventor 谷德君卢继奎
Owner SHENYANG KINGSEMI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products