A disc-shaped object clamping device with a position-limiting structure

Abstract

The invention discloses a disk clamping device. The disk clamping device comprises a rotating chuck for placing a disk, a rotating shaft driving the rotating chuck to rotate, and a drive mechanism driving the rotating shaft to rotate, wherein the rotating chuck comprises a substrate, a clamping element arranged at the periphery of the substrate, a ring-shaped body and a limit structure. The clamping element comprises a main body part and a clamping part, wherein the main body part rotates automatically, so that the clamping part moves between an open position and a clamping position. The ring-shaped body and the main body part of the clamping element form a meshing surface, and the main body part is meshed with the ring-shaped body to be automatically rotated by the meshing surface when the substrate is rotated relative to the ring-shaped body. The limit structure comprises a first limit part and a second limit part arranged on the substrate and the ring-shaped body, and the first limit part is in contact with the second limit part to constraint relative rotation in the first direction when the substrate is relatively rotated in the first direction in relative to the ring-shaped body to facilitate movement of the clamping part from the opened position to the clamping position, thereby adjusting a force of the clamping part which acts on the lateral side of a silicon wafer.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a disk clamping device with a position limiting structure. Background technique [0002] In the production process of integrated circuits, discs such as semiconductor wafers or silicon wafers are subjected to various surface treatment steps such as etching, cleaning, polishing, thin film deposition, and the like. However, in these processes, it is necessary to support and clamp the disk by a clamping device. For example, U.S. Patent No. 4,903,717A discloses a clamping device, which includes a clamping element and a chuck. The clamping element includes a main body and a clamping portion whose axes deviate from each other, so that when the main body rotates, the radial position of the clamping portion follows. Variety. When the clamping part moves radially outward to the open position, the silicon wafer can be taken and placed, and when the clamping part moves ra...

AI Technical Summary

Problems solved by technology

However, when the clamping part moves to the clamping position, it will often cause impact on the edge of the silicon wafer, and the excessive clamping force will cause deformation and fragmentation of the silicon wafer, and too small clamping force will make the silicon wafer relatively Clamping device slides easily

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