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Wiring defect detection method and wiring defect detection device

A defect detection and wiring technology, applied in the direction of measuring devices, material defect testing, semiconductor/solid-state device testing/measurement, etc., can solve problems such as not easy to determine the position, and achieve a good segmentation detection effect

Inactive Publication Date: 2014-04-30
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in array inspection, even if the presence or absence of a defect in the wiring portion can be detected, it is not easy to identify the position of the defect.

Method used

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  • Wiring defect detection method and wiring defect detection device
  • Wiring defect detection method and wiring defect detection device
  • Wiring defect detection method and wiring defect detection device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0074] refer to Figure 1 to Figure 5 and Figure 8 One embodiment of the wiring defect detection device and the wiring defect detection method according to the present invention will be described.

[0075] (Configuration of wiring defect detection device)

[0076] figure 1 (a) is a block diagram showing the structure of the wiring defect detection apparatus 100 of this embodiment, figure 1 (b) is a perspective view of the motherboard 1 which is the target of wiring defect detection using the wiring defect detection apparatus 100.

[0077] The wiring defect detection device 100 can be formed in figure 1 Defects such as wiring are detected in the plurality of liquid crystal panels 2 (panels) on the mother substrate 1 shown in (b). The liquid crystal panel 2 can be applied to a relatively large panel of about 60 inches.

[0078] Such as figure 1 As shown in (a), the wiring defect detection apparatus 100 is equipped with the probe 3 which conducts with the liquid cryst...

Embodiment approach 2

[0189] refer to Figure 1 to Figure 5 and Figure 9 Another embodiment of the wiring defect detection device and the wiring defect detection method according to the present invention will be described.

[0190] (Configuration of wiring defect detection device)

[0191] Other embodiments related to the present invention will be described.

[0192]In this embodiment, the same device as that in Embodiment 1 is used.

[0193] In Embodiment 1, the inspection area obtained by dividing the liquid crystal panel 2 into two is subjected to infrared inspection for wiring defect detection, but in this embodiment, the division of the liquid crystal panel is further described. Infrared inspection of several cases.

[0194] (Wiring defect detection method)

[0195] Figure 7 It is a flowchart of the wiring defect detection method using the wiring defect detection apparatus 100 which concerns on this embodiment.

[0196] In Embodiment 1, a relatively large liquid crystal panel of, for ...

Deformed example 1

[0255] As a first modified example, a case where the inspection is performed sequentially from top to bottom in a vertical row can be mentioned. You can set the first vertical column to be checked as the leftmost column, and then check the vertical column next to this column from top to bottom. Scan the columns to check. In addition, when inspection is performed sequentially in this way, as the pad corresponding to the inspection region Rk, 19a1 is selected in the defect detection mode A r ~19a5 r and 19d1 q ~19d10 q , select 19d1 in defect detection mode B q ~19d10 q , select 19a1 in defect detection mode C r ~19a5 r .

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Abstract

Provided are a wiring defect detection method and device that enable defects to be appropriately detected when capturing images of panels multiple times using an infrared camera. This wiring defect detection method involves acquiring correspondences between inspection regions and pads corresponding to the inspection regions. This wiring defect detection device is provided with a pad switching means which, on the basis of said correspondences, switches pads that supply power to the pads corresponding to the inspection regions.

Description

technical field [0001] The present invention relates to a wiring defect detection method and a wiring defect detection device suitable for defect detection of wiring formed in panels such as liquid crystal panels and solar panels, and particularly relates to a wiring defect detection method for large panels and wiring defect detection device. Background technique [0002] As an example of a semiconductor substrate, for example, the manufacturing process of a liquid crystal panel is roughly divided into an array (TFT) process, a cell (liquid crystal) process, and a module process. Among them, in the array process, after forming gate electrodes, semiconductor films, source / drain electrodes, protective films, and transparent electrodes on a transparent substrate, array inspection is performed to detect the presence or absence of short circuits in electrodes or wiring. . [0003] Usually, in array testing, such defects are identified by touching a probe to an end of a wiring t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/72G01R31/02H01L21/66
CPCG01R1/071G09G3/36G01R31/308G09G3/006
Inventor 柳濑正和
Owner SHARP KK