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Systems and methods for producing silicon slim rods

A thin rod, cooling system technology, used in the field of silicon cutting systems

Inactive Publication Date: 2014-05-07
ATS AUTOMATION TOOLING SYSTEMS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] In general, the cost of producing thin rods is a significant cost factor in the production of high purity polysilicon

Method used

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  • Systems and methods for producing silicon slim rods
  • Systems and methods for producing silicon slim rods
  • Systems and methods for producing silicon slim rods

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Embodiment Construction

[0049] In general, the present application provides methods and systems for producing or preparing silicon thin rods. The present systems and methods involve processing polysilicon into ribbons (thin rods) from which filaments are composed. In one embodiment, an ingot of silicon is processed into a billet of appropriate thickness, which is then further processed into approximately square ribbons (thin rods) using one or more of the methods described below. These systems and methods can be broadly divided into cutting and lysing, both of which address zero or low kerf approaches. The described cutting methods aim to produce reduced kerfs and less breakage, resulting in higher material utilization. The described pyrolysis method can produce zero-width kerfs, resulting in even higher material utilization. The cracking method involves using a laser to create internal stresses in the material so that cracks propagate in a controlled manner. Cleavage can be performed by streaking...

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Abstract

A method and system for preparing polysilicon slim rods, the method and system including: placing a piece of polysilicon on a fixture; applying a predetermined laser beam or abrasive jet to the piece of polysilicon; and separating a polysilicon slim rod from the piece of polysilicon. The laser beam may be used for either cutting or for cracking depending on the operating parameters chosen. There may also be various combinations of cutting and cracking used in order to separate the slim rod from the piece of polysilicon. For example, the laser cut may be a scribing and / or partial cut and the separation may be completed by cracking the remaining silicon. In this case, the cracking may be accomplished by, for example, mechanical bending or laser cracking. Generally speaking, a laser beam used for cracking may be different from and have differing operating parameters from a laser beam used for cutting.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority to US Provisional Patent Application 61 / 513,237, filed July 29, 2011, which is incorporated herein by reference. technical field [0003] The present application generally relates to systems and methods for dicing silicon. More specifically, the present application relates to systems and methods for producing and processing silicon thin rods. Background technique [0004] One process for producing polysilicon material used by various industries involves "growing" polysilicon onto a substrate of high purity polysilicon. For example, the Siemens process or similar chemical vapor deposition (CVD) processes are used to produce about 80% of the high-purity polysilicon currently produced. In the Siemens process, polycrystalline silicon cylinders (sometimes called boules) are produced by pyrolyzing gaseous silicon compounds onto silicon substrates (sometimes called thin rods)....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/53B23K26/70B23K26/14C01B33/021
CPCB23K2103/50B23K26/40C01B33/035B23K26/0006Y10T225/10Y10T225/304B23K2103/42B23K2103/56B24C1/045B26F3/16B23K26/402
Inventor 杰拉尔德·伍顿史蒂芬·范·鲁克
Owner ATS AUTOMATION TOOLING SYSTEMS
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