Device and operating method for preventing silicon wafer from offset and cracking in cavity transporting process

Abstract

The invention discloses a device for preventing a silicon wafer from offset and cracking in a cavity transporting process. The device comprises a cavity, at least three photoelectric sensors, a control device and a manipulator, a top cover of the cavity is made of transparent material; the photoelectric sensors are not on a straight line and fixedly installed on the top cover of the cavity, signal ends of the at least three photoelectric sensors are connected in series to the control device, the control device is connected with the manipulator, and the silicon wafer is moved through the manipulator. The device in the invention can accurately monitor the position of the silicon wafer, and once offset of the silicon wafer is monitored, the device performs braking and gives an alarm in time, thereby preventing the silicon wafer from being cracked up or entering the cavity with offset and causing abnormal film formation.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit manufacturing process equipment, in particular to a device for preventing silicon wafers from shifting fragments during cavity conveyance, and also relates to an operation method of the device. Background technique [0002] In semiconductor equipment, when aluminum is sputtered onto the surface of a silicon wafer at high temperature, the silicon wafer will easily stick to the cavity of the machine in a molten state, causing the position of the mechanical arm to shift when taking the wafer. However, the existing Under the process conditions, after the aluminum film formation is completed, it is transported to other process chambers for film formation, causing the silicon wafers to be broken in the chamber, and the cover plate of the chamber (transfer chamber or buffer chamber, etc.) cannot detect the silicon wafer on the conveying arm Whether there is an offset, and it is impossible to detect w...

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Problems solved by technology

[0002] In semiconductor equipment, when aluminum is sputtered onto the surface of a silicon wafer at high temperature, the silicon wafer will easily stick to the cavity of the machine in a molten state, causing the position of the mechanical arm to shift when taking the wafer. However, the existing Under the process conditions, after the aluminum film formation is completed, it is transported to other process chambers for film formation, causing silicon wafers to be broken in the chamber, and the cover plate of the chamber (transfer chamber or buffer chamber, etc.) cannot detect the silicon wafer on the conveying arm Whether there is an offset, and it is impossible to detect whether the silicon wafer (wafer) is offset or tilted in the process chamber, which often causes losses

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