Single-component epoxy resin adhesive and preparation method thereof
An epoxy resin and adhesive technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of not too fast curing speed, speed up curing speed, influence of mechanical properties of curing system, etc., to achieve equipment and process. Small dependence, improved mechanical properties, and the effect of adapting to large-scale automated production
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Embodiment 1
[0028] Weigh 100 grams of E-51 epoxy resin (epoxy value: 0.48 to 0.54), add 326 grams of aldehyde and ketone resin-based ethylenediamine ketimine as a latent curing agent, stir at room temperature for 10 minutes to mix evenly, that is A one-component epoxy resin adhesive is obtained.
[0029] The one-component epoxy resin adhesive is stored under dry conditions at 25°C and has a pot life of 33 days. The relative humidity of the environment is 79%, and after curing at 25°C for 24 hours, the shear strength reaches 2.40MPa, which is 52% higher than when ethylenediamine is used as the curing agent under the same conditions (measured according to the national standard GB / T7124-2008).
Embodiment 2
[0031] Weigh 100 grams of E-51 epoxy resin (epoxy value: 0.48 to 0.54), add 181 grams of aldehyde and ketone resin-based hexamethylenediamine ketimine as a latent curing agent, stir at room temperature for 10 minutes to mix evenly, that is A one-component epoxy resin adhesive is obtained.
[0032]The one-component epoxy resin adhesive is stored under dry conditions at 25°C and has a pot life of 32 days. The relative humidity of the environment is 79%, and after curing at 25°C for 24 hours, the shear strength reaches 2.47MPa, which is 57% higher than when hexamethylenediamine is used as the curing agent under the same conditions (measured according to the national standard GB / T7124-2008).
Embodiment 3
[0034] Weigh 100 grams of E-51 epoxy resin (epoxy value: 0.48 to 0.54), add 173 grams of aldehyde and ketone resin-based hexamethylenediamine ketimine as a latent curing agent, stir at 10°C for 30 minutes to mix evenly, that is A one-component epoxy resin adhesive is obtained.
[0035] The one-component epoxy resin adhesive is stored under dry conditions at 25°C and has a pot life of 34 days. The relative humidity of the environment is 79%, and after curing at 25°C for 24 hours, the shear strength reaches 2.42MPa, which is 52% higher than when hexamethylenediamine is used as the curing agent under the same conditions (measured according to the national standard GB / T7124-2008).
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