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Single-component epoxy resin adhesive and preparation method thereof

An epoxy resin and adhesive technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of not too fast curing speed, speed up curing speed, influence of mechanical properties of curing system, etc., to achieve equipment and process. Small dependence, improved mechanical properties, and the effect of adapting to large-scale automated production

Active Publication Date: 2015-06-10
ZHENGZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Generally, although the one-component epoxy resin adhesive prepared by dicyandiamide and organic hydrazide latent curing agents has excellent storage performance, the curing temperature is relatively high, and many devices and materials are difficult to withstand such high temperatures, which limits the Its scope of use; for microcapsule latent curing agents, the difficulty of capsule destruction becomes an important factor for its activity and stability
When the capsule membrane is weak, it is easier to break during the preparation of the composition or during transportation; when the membrane is strong, it is necessary to add a temperature and pressure necessary for membrane destruction, so there are still some problems in the practical process
However, the one-component epoxy resin adhesive prepared by ketimine latent curing agent can be cured at room temperature, and the curing speed is not too fast, and the pot life is not as long as other latent curing agents. Add water or tertiary amine to promote agent, it can speed up the curing speed, but the remaining ketone compounds in the curing system will affect the mechanical properties of all aspects of the curing system

Method used

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  • Single-component epoxy resin adhesive and preparation method thereof
  • Single-component epoxy resin adhesive and preparation method thereof
  • Single-component epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Weigh 100 grams of E-51 epoxy resin (epoxy value: 0.48 to 0.54), add 326 grams of aldehyde and ketone resin-based ethylenediamine ketimine as a latent curing agent, stir at room temperature for 10 minutes to mix evenly, that is A one-component epoxy resin adhesive is obtained.

[0029] The one-component epoxy resin adhesive is stored under dry conditions at 25°C and has a pot life of 33 days. The relative humidity of the environment is 79%, and after curing at 25°C for 24 hours, the shear strength reaches 2.40MPa, which is 52% higher than when ethylenediamine is used as the curing agent under the same conditions (measured according to the national standard GB / T7124-2008).

Embodiment 2

[0031] Weigh 100 grams of E-51 epoxy resin (epoxy value: 0.48 to 0.54), add 181 grams of aldehyde and ketone resin-based hexamethylenediamine ketimine as a latent curing agent, stir at room temperature for 10 minutes to mix evenly, that is A one-component epoxy resin adhesive is obtained.

[0032]The one-component epoxy resin adhesive is stored under dry conditions at 25°C and has a pot life of 32 days. The relative humidity of the environment is 79%, and after curing at 25°C for 24 hours, the shear strength reaches 2.47MPa, which is 57% higher than when hexamethylenediamine is used as the curing agent under the same conditions (measured according to the national standard GB / T7124-2008).

Embodiment 3

[0034] Weigh 100 grams of E-51 epoxy resin (epoxy value: 0.48 to 0.54), add 173 grams of aldehyde and ketone resin-based hexamethylenediamine ketimine as a latent curing agent, stir at 10°C for 30 minutes to mix evenly, that is A one-component epoxy resin adhesive is obtained.

[0035] The one-component epoxy resin adhesive is stored under dry conditions at 25°C and has a pot life of 34 days. The relative humidity of the environment is 79%, and after curing at 25°C for 24 hours, the shear strength reaches 2.42MPa, which is 52% higher than when hexamethylenediamine is used as the curing agent under the same conditions (measured according to the national standard GB / T7124-2008).

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Abstract

The invention relates to a single-component epoxy resin adhesive and a preparation method thereof, and belongs to the field of adhesives. The single-component epoxy resin adhesive comprises a latent curing agent and epoxy resin; the latent curing agent adopts ketimine of formula (I) or (II) as shown in the description, wherein R is shown in the description, n is 2-5, m is 2-6, and both n and m are integers. The adhesive of the present invention has certain storage stability under a dry condition, has low dependency on equipment and process, and is well suitable for large-scale automatic production.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a one-component epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin adhesive is a kind of engineering adhesive prepared by epoxy resin main material, curing agent, etc. It has a wide range of bonding objects, small shrinkage of the system after curing, good aging resistance, chemical medium resistance, and small curing internal stress. , Adjustable curing temperature and good processing performance and construction technology, etc., are widely used in various aspects. Aldehyde and ketone resin is a kind of thermoplastic resin synthesized by cyclohexanone and formaldehyde under the action of catalyst. The resin has excellent characteristics: neutrality, light color, resistance to ultraviolet radiation, high hardness, excellent weather resistance and chemical resistance. How to introduce the excellent properties of aldehy...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C08G59/40
Inventor 张延武姜俊青杨国张晓磊
Owner ZHENGZHOU UNIV