Smart Card Test Device
A test device and smart card technology, applied in the direction of measurement device, measurement of electricity, measurement of electric variables, etc., can solve the problems of complicated and difficult test procedures
Inactive Publication Date: 2014-07-16
CHIPBOND TECH
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[0002] see Figure 11 , a test device for testing smart cards, the test device 300 has a test platform 310 and a plurality of probes 320, the probes 320 are arranged on the test platform 310, the smart card 400 has a plurality of connection pads 410, each of which Probes 320 correspond to each of the connection pads 410 to test whether each of the connection pads 410 is normal. Since the test device 300 can only test the connection pads 410 located on the upper surface 420 of the smart card 400, if it is necessary to test the connection pads 410 located on the lower surface of the smart card 400 The connection pad 410 on the surface 430 needs to be turned over to test the connection pad 410 on the lower surface 430 after the connection pad 410 on the upper surface 420 of the smart card 400 is tested, resulting in a complicated test process. with difficulty
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[0063] In order to further explain the technical means and effects that the present invention adopts to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the specific implementation, structure, features and effects of the smart card testing device proposed according to the present invention are as follows: Details are as follows.
[0064] see figure 1 , which is an embodiment of the present invention, a smart card testing device 100, which includes a first testing module 110 and a second testing module 120, in this embodiment, the second testing module 120 is located in the first testing module 110 below, see the figure 1 , figure 2 and image 3 , the first test module 110 has a first circuit board 111, a first probe base 112, a pressing plate 113, a first probe set 114, a limiting member 115, an elastic member 116 and a guide column 117, the first probe The needle base 112 is located between th...
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The invention relates to a smart card test device for testing smart cards. Each smart card is provided with a first connecting pad and a second connecting pad. The smart card test device is provided with a first test module and a second test module. The first test module is provided with a first circuit board, a first probe seat, a laminated board and a first probe set. Each first probe set corresponds with the first connecting pad for testing each first connecting pad. The second test module is provided with a second probe seat, a base and a second probe set. Each second probe set corresponds with the second connecting pad for testing each second connecting pad. The first test module tests first conductive connecting pad of each smart card, and the second test module tests second conductive connecting pad of each smart card, and therefore a test process for the smart card can be simplified.
Description
technical field [0001] The invention relates to a smart card testing device, in particular to a smart card testing device capable of testing a first connection pad located on the upper surface of the smart card and a second connection pad located on the lower surface of the smart card. Background technique [0002] see Figure 11 , a test device for testing smart cards, the test device 300 has a test platform 310 and a plurality of probes 320, the probes 320 are arranged on the test platform 310, the smart card 400 has a plurality of connection pads 410, each of which Probes 320 correspond to each of the connection pads 410 to test whether each of the connection pads 410 is normal. Since the test device 300 can only test the connection pads 410 located on the upper surface 420 of the smart card 400, if it is necessary to test the connection pads 410 located on the lower surface of the smart card 400 The connection pad 410 on the surface 430 needs to be turned over to test th...
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IPC IPC(8): G01R31/00
Inventor 陈俊宪谢连滋孙崇哲周博生
Owner CHIPBOND TECH