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Inverted glue injection mechanism of injection mold system

An injection mold and flip-chip technology, which is applied in the field of flip-chip glue feeding mechanism, can solve problems affecting product quality and product appearance, and achieve the effect of maintaining a good image and improving product quality

Inactive Publication Date: 2014-08-13
IMASS SANDER MFG SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the production process of injection molds, when the product appearance requirements are high, the appearance of the product and the quality of the product are often affected by the conventional glue feeding and thimble ejection methods.

Method used

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  • Inverted glue injection mechanism of injection mold system

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Experimental program
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Effect test

Embodiment Construction

[0011] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0012] refer to figure 1 As shown, a flip-chip feeding mechanism of an injection mold system includes a positioning ring 1, a nozzle 2, a male template 3 and a product cavity 4, and the positioning ring 1 is fixed on the center of the bottom plate 5 by an end face screw 12, and the pump The nozzle 2 is locked behind the male template 3 by screws 6, and the nozzle 2 is connected to the product cavity 4 through the flow channel 7. The male template 3 is provided with a thimble 8, one end of which is connected to the product cavity 4, and the other end is fixed to the On the thimble plate 9 , the thimble plate 9 is connected to a front formwork drawing plate 11 through bolts 10 , and a bottom plate 5 is arranged below the front formwork drawing plate 11 .

[0013] Preferably, both the ejector pin plate 9 and the bottom plate 5 are arra...

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PUM

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Abstract

The invention relates to an inverted glue injection mechanism of an injection mold system. The inverted glue injection mechanism comprises a positioning ring, a sprue, a male mold plate and a product cavity, wherein the positioning ring is fixed at the center of a bottom plate; the sprue is locked behind the male mold plate by a screw and is communicated with the product cavity by a flow channel; the male mold plate is provided with an ejector pin; one end of the ejector pin is connected with the product cavity and the other end of the ejector pin is fixedly connected onto an ejector pin plate which is connected with a front mold pulling plate by a bolt; a bottom plate is arranged under the front mold pulling plate. According to the technical scheme, inverted glue injection can be realized by the inverted glue injection mechanism, the good appearance of a product is maintained and the quality of the product is improved.

Description

technical field [0001] The invention relates to the field of injection molds, in particular to a flip-chip glue feeding mechanism of an injection mold system. Background technique [0002] In the production process of injection molds, when the product appearance requirements are high, the appearance of the product and the quality of the product are often affected by the conventional glue feeding and thimble ejection methods. Contents of the invention [0003] The purpose of the present invention is to overcome the problems existing in the prior art, and provide a flip-chip glue feeding mechanism of an injection mold system. [0004] In order to achieve the above-mentioned technical purpose and achieve the above-mentioned technical effect, the present invention is realized through the following technical solutions: [0005] A flip-chip feeding mechanism of an injection mold system, including a positioning ring, a nozzle, a male template and a product cavity, the positionin...

Claims

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Application Information

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IPC IPC(8): B29C45/26
CPCB29C45/26
Inventor 申风浦险峰汪美娟
Owner IMASS SANDER MFG SUZHOU