Electronic part installation system and substrate conveying method of electronic part installation system

Abstract

The invention provides an electronic part installation system and a substrate conveying method of an electronic part installation system. The substrate conveying method performs delivering between the devices. The electronic part installation system (1) temporarily stops controlling or controls again when conveying large size substrates (K1). When the electronic part installation system (1) temporarily stops controlling, the controlling part (90B) performs substrate detection through the downstream sensor (378B) of the downstream electronic part installation device (10B) to enable the conveyance to stop temporarily; and the control part (90A) enables the conveyance to stop conveying according to the temporary stop notification of the electronic component installation device from the downstream; in restart controlling, if the controlling part determines that the operation area of the downstream side electronic component installation device is empty, the conveyance begins. Furthermore, the controlling part of the upper stream side electronic component installation device receives the moving in permission notice of the downstream side electronic component part installation device which is moving into the operation area, the conveyance begins again.

Description

technical field [0001] The present invention relates to an electronic component for carrying out substrate transport between two transport mechanisms [0002] A mounting system and a substrate delivery method thereof. Background technique [0003] In a conventional electronic component mounting device, the range of a working area for mounting components on a board inside the device is determined in accordance with the external dimensions of the device, and the upper limit of the size of the board on which components can be mounted is determined accordingly. Therefore, by adjusting the position of the sensor for determining the position of the board in the work area to the downstream side in the conveyance direction, the board in the work area is further arranged downstream in the conveyance direction, and the electronic components are mounted. Mounting work of a substrate larger than a predetermined size (for example, refer to Patent Document 1). [0004] On the other hand...

AI Technical Summary

Problems solved by technology

Therefore, the electronic component mounting device on the upstream side cannot complete the unloading operation of the substrate, and cannot realize proper linkage of the conveying operation, and may cause erroneous stops due to poor conveyance, etc.

As a result, the entire production line may be stopped and the operating rate may be greatly reduced.

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