GSM mobile communication front-end module circuit device

Abstract

The invention discloses a GSM mobile communication front-end module circuit device which comprises a printed circuit board, a power amplification chip, a radio frequency switch chip and a control chip. The printed circuit board is a two-layer circuit board and has an insulating layer and two metal layers arranged on the insulating layer. The power amplification chip is disposed on the printed circuit board. The radio frequency switch chip is arranged on the printed circuit board and is electrically connected with the power amplification chip. The control chip is mounted on the printed circuit board and is electrically connected with the power amplification chip and the radio frequency switch chip. The control chip can be used in power control of the power amplification chip and provides a control signal to the radio frequency switch chip.

Description

technical field [0001] The invention relates to a front-end module circuit, in particular to a front-end module circuit device for GSM mobile communication. Background technique [0002] With the rapid development of science and technology, the invention of mobile phones has brought convenience to human beings and has become one of the indispensable items in people's lives. Nowadays, mobile phones are not only used for functions such as answering calls and sending and receiving text messages, Smartphones with more convenient functions, and the appearance of mobile phones are designed to be light, thin, short, and small to satisfy consumers. Compared with the front-end module circuits used in mobile phones, the size needs to be continuously reduced. technology to meet the needs of consumers. [0003] The front-end module circuit (Front-End Module) applied to mobile phones is used to process and send and receive radio frequency signals and integrate multiple related electro...

AI Technical Summary

Problems solved by technology

In order to meet consumers' demands for light, thin, short, and small mobile phones, it is necessary to reduce the size of each component of the front-end module circuit used in the mobile phone, and to integrate more functions, which relatively increases the complexity of the front-end module. , unit area and cost need to be improved

[0004] Take the RDA6232 and SKYWORK 77531 integrated front-end modules commonly used in the industry as examples. Among them, the RDA6232 integrated front-end module has four chips responsible for the above functions, and uses a double-layer printed circuit board. Complex layout and high cost

Although the SKYWORK 77531 integrated front-end module only uses 3 integrated chips, it uses a 4-layer metal structure printed circuit board for circuit layout, which relatively increases the cost

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