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Metal post joints using prefabricated metal posts

A technology of metal pillars and metals, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as difficulty in controlling the length consistency of metal leads, low production volume, etc.

Active Publication Date: 2017-01-18
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this process has very low throughput
In addition, it is difficult to control the consistency of metal lead length

Method used

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  • Metal post joints using prefabricated metal posts
  • Metal post joints using prefabricated metal posts
  • Metal post joints using prefabricated metal posts

Examples

Experimental program
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Embodiment Construction

[0032] The making and using of embodiments of the invention are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are illustrative only, and do not limit the scope of the invention.

[0033] Metal pillar manufacturing processes and methods of bonding prefabricated metal pillars on package components are provided in accordance with various exemplary embodiments. Intermediate stages of forming and bonding metal posts are shown. Variations of the embodiments are discussed. Like reference numerals are used to represent like elements throughout the various views and illustrative embodiments.

[0034] figure 1 A perspective view of a plurality of metal posts 20 is shown. According to some embodiments, metal pillar 20 includes copper. In alternative embodiments, metal pillars 20 include aluminum, tungs...

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Abstract

A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.

Description

[0001] This application claims priority to US Provisional Application No. 61 / 798,553, filed March 15, 2013, entitled "Metal Post Bonding Using Pre-Fabricated Metal Posts," the entire contents of which are hereby incorporated by reference. technical field [0002] The present invention relates generally to semiconductors and, more particularly, to devices including columns of metal pillars, methods of forming columns of metal pillars, and apparatus for bonding metal pillars. Background technique [0003] In the bonding of integrated circuits, solder pads, copper pillars, etc. are used to bond the device die to the packaging substrate. However, warpage of the die and package substrate can occur. Additionally, packaging processes often involve thermal processes that heat the package. Since the package includes different materials with different coefficients of thermal expansion (CTE), stress is applied to the package after bonding. For example, the packaging substrate typical...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
Inventor 萧义理杨素纯董志航史达元余振华
Owner TAIWAN SEMICON MFG CO LTD