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Radiation shielding for substrate holders

A technology of shielding member and substrate, applied in the field of radiation shielding member of substrate holder, can solve the problems of increased energy consumption, uneven processing in the substrate, increased cost, etc.

Active Publication Date: 2017-04-19
ASM IP HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such intra-substrate temperature variations can result in non-uniformity of processing within the substrate
In some setups, substrates exhibiting such non-uniformity can yield defective devices
In addition, precipitation products can settle in the lower process chamber, leading to a decrease in the temperature in the reaction chamber, thus increasing energy consumption to overcome insufficient heating
Additionally, accumulation of precipitated products in the chamber can result in the need to clean the chamber prematurely and increase costs

Method used

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  • Radiation shielding for substrate holders
  • Radiation shielding for substrate holders
  • Radiation shielding for substrate holders

Examples

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Embodiment Construction

[0030] Certain substrate processing tools may include environments that alter the amount of incident radiation reflected therein. For example, various materials, surface finishes, surface coatings, and / or environmental geometry can affect the reflected thermal radiation within the substrate processing tool, possibly creating a non-uniform temperature field within the substrate being processed within the substrate processing tool.

[0031] For example, a substrate supported by a susceptor heater assembly heated by one or more resistive heaters may lose heat by thermal radiation to the low pressure environment within the substrate processing tool. Such radiative losses may increase as susceptor heater assembly temperature increases. Furthermore, since the area between the susceptor heater assembly and the surrounding low pressure environment may be non-uniform in some arrangements, the radiation trapping properties of the substrate processing tool environment may affect radiatio...

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Abstract

A reaction chamber comprising: a substrate support member positioned within the reaction chamber, a reaction chamber having a first region and a second region, a shield positioned within the second chamber and movable with the substrate support member, wherein , the shield is adjacent to at least the bottom surface of the substrate support member.

Description

[0001] Cross-references to related applications [0002] This application claims the benefit of priority to US Patent Provisional Application No. 61 / 563,428, filed November 23, 2011, the disclosure of which is incorporated herein by reference. Background technique [0003] Heating a substrate being processed in a substrate processing tool can be difficult. Variations in substrate heating can result in temperature variations within the substrate. Such intra-substrate temperature variations can result in non-uniformity of processing within the substrate. In some settings, a substrate exhibiting such non-uniformity can yield defective devices. In addition, precipitation products may settle in the lower process chamber, resulting in a decrease in temperature within the reaction chamber and, therefore, increased energy consumption to overcome insufficient heating. Additionally, accumulation of precipitated products within the chamber can result in the need to clean the chamber ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67115H05B1/0233H05B3/68
Inventor E·谢罗M·哈平J·温克勒
Owner ASM IP HLDG BV
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