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Shoe mould picking and placing device

A pick-and-place device and shoe mold technology, which is applied in the field of machinery, can solve the problems of heavy workload, trouble, shoe upper strain or tear, etc., and achieve the effect of compact structure and convenient use

Inactive Publication Date: 2014-10-08
WUXI CITY CHONGAN DISTRICT TECH ENTREPRENEURSHIP SERVICE CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional shoe modules are all fixed. It is very convenient to attach the upper to the shoe module, but it is very troublesome to remove the upper from the shoe module. The shoe module does not move, so the upper can only be removed by the upper itself. The deformation of the shoe is separated from the shoe module, and the upper is easily pulled, deformed, or even damaged. At the same time, it takes a long time, wastes time, and increases the difficulty of operation.
[0003] The front and rear ends of the traditional shoe module have no curved radians. After the shoe is shaped on the shoe module, it is difficult to remove it. If the force is not correct, it is easy to pull or tear the upper. And labor costs are wasted, and it takes a lot of force to remove it, because it needs to be removed manually, so the workload brought to the operator is relatively large, reducing production efficiency

Method used

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  • Shoe mould picking and placing device

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Embodiment Construction

[0013] The present invention will be further explained below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are only used to illustrate the present invention but not to limit the scope of the present invention. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer ” refer to directions towards or away from the geometric center of a particular part, respectively.

[0014] It can be seen from the accompanying drawings that the shoe mold pick-and-place device includes a pole 4 and a shoe module 1, the bottom end of the pole 4 is fixed on the landing floor 5, and the top of the pole 4 is provided with a curved elbow 2. A handle 3 is provided on the rod 4 below the elbow 2, and the shoe module 1 is clipped on the elbow 2, and a curved hole is provided at...

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Abstract

A shoe mould picking and placing device comprises a support rod and a shoe mould block. The bottom end of the support rod is fixed on a floor, a bended bend is arranged at the top end of the support rod, a holding portion is arranged on the support rod at the position under the bend, the bend is in clamping connection with a shoe mould block, a bending hole is formed in the bottom of the shoe mould block, and the bend is clamped in the bending hole. An included angle of 75-85 degrees is formed between the bend and the support rod, the cross section of the bend is triangular, the section of the bending hole is consistent with the cross section of the bend, the bend is clamped in the bending hole completely in a meshing mode, and the bend can be pulled out from the bending hole. The shoe mould picking and placing device is compact in structure and convenient to use. The shoe mould block can be installed or taken down quickly, and an upper can be picked from the shoe mould block smoothly under well protection.

Description

technical field [0001] The invention relates to a pick-and-place device for shoe molds, which is a tool for installing or picking and placing shoe molds, and belongs to the mechanical field. Background technique [0002] Shoes are an essential item of life. During the manufacturing process of shoes, the inside of the shoe must be supported to make the upper surface of the shoe arch up smoothly, so that the upper can be shaped. After the upper is shaped on the shoe module, the upper should be Remove it from the shoe module and proceed to the subsequent process. The traditional shoe modules are all fixed. It is very convenient to attach the upper to the shoe module, but it is very troublesome to remove the upper from the shoe module. The shoe module does not move, so the upper can only be removed by the upper itself. The deformation of the shoe is separated from the shoe module, and the upper is easily pulled, deformed, or even damaged. At the same time, it takes a long time,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A43D3/10
Inventor 陈伟新肖运根章隆泉过俊宏顾肖红
Owner WUXI CITY CHONGAN DISTRICT TECH ENTREPRENEURSHIP SERVICE CENT