A kind of cutting method of mems wafer

Abstract

The invention provides a method for cutting MEMS (micro-electromechanical system) wafers. The method includes steps of 1), cutting partial non-bonding regions at the edges of covering wafers of the MEMS wafers and removing the partial non-bonding regions to expose device patterns of device wafers; 2), pre-cutting the covering wafers in partition regions among various MEMS cavities along first directions to form a plurality of cutting channels, and reserving covering wafers with preset thicknesses; 3), cutting the partition regions among the various MEMS cavities along second directions perpendicular to the first directions; 4), cutting the partition regions among the various MEMS cavities along the first directions to separate the covering wafers of the various MEMS cavities. The method has the advantages that the problem of difficulty in alignment when wafers without patterns on the surfaces of the wafers are cut can be solved by the aid of the method, high-quality cavity structures can be manufactured by the method, each wafer with an unpolluted PAD on a CMOS (complementary metal oxide semiconductor) surface of the wafer can be obtained, and the problem of easiness in damage to equipment and blades can be solved by the aid of the method; cutting equipment and a cutting process for the method are compatible to the traditional process, the steps of the method are simple, and the method is applicable to industrial production.

Description

technical field [0001] The invention relates to a cutting process of a semiconductor device, in particular to a cutting method of a MEMS wafer. Background technique [0002] Micro-electromechanical system MEMS mainly includes micro-mechanisms, micro-sensors, micro-actuators and corresponding processing circuits. Frontier disciplines. [0003] The development of MEMS technology has opened up a new technical field and industry. Micro-sensors, micro-actuators, micro-components, micro-mechanical optical devices, vacuum micro-electronic devices, power electronic devices, etc. made by MEMS technology are used in aviation, aerospace, automobile, There are very broad application prospects in biomedicine, environmental monitoring, military and almost all fields that people come into contact with. MEMS technology is developing into a huge industry, just like the great changes brought to mankind by the microelectronics industry and the computer industry in the past 20 years, MEMS is ...

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for cutting MEMS wafers, which is used to solve the difficulty in cutting and aligning MEMS wafers in the prior art and the difficulty in cutting caused by excessive fragments generated during the cutting process. , damage to the device structure, easy damage to the cutting tool, etc.

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