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A light-emitting diode solid crystal jig

A technology of light-emitting diodes and fixtures, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low efficiency, long time, and inability to meet mass production requirements, and achieve high production efficiency.

Active Publication Date: 2017-02-15
CHERY AUTOMOBILE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current die-bonding fixtures are basically manual, and the circuit boards to be bonded are frequently manually installed in the die-bonding fixture. Although the cost is low, it takes a long time and is inefficient. It is only suitable for small batch trial production. Unable to meet mass production requirements

Method used

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  • A light-emitting diode solid crystal jig
  • A light-emitting diode solid crystal jig
  • A light-emitting diode solid crystal jig

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] see figure 1 , the embodiment of the present invention provides a light emitting diode die bonding fixture 100, which is applied in a light emitting diode die bonding machine. The LED die bonding fixture 100 includes a fixture body 10 , a first driver 20 , a second driver 30 , a positioning plate 40 , a circuit board 50 and a pressure plate 60 .

[0025] The jig body 10 and the pressing plate 60 form a cavity. The first driving machine 20 , the second driving machine 30 , the positioning plate 40 and the circuit board 50 are all accommodated in the cavity. The second driving machine 30 is used to push and open the pressing plate 60 . The first driving machine 20 is used to push out the positioning plate 40 accommodated in the...

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PUM

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Abstract

The invention discloses a light-emitting diode solid crystal fixture, which comprises a fixture main body, a first driving machine, a second driving machine, a positioning plate, a circuit board and a pressing plate; the main body of the fixture and the pressing plate form a cavity, and the The pressure plate is provided with an array of holes; the first driver, the second driver, the positioning plate and the circuit board are all accommodated in the cavity; the positioning plate is slidably connected to the fixture main body, The first driving machine drives the positioning plate to slide in the first direction to push out the positioning plate; the circuit board is fixed on the positioning plate; the second driving machine drives the pressing plate to move in the second direction to push out the positioning plate. The cavity is opened, and the second direction is perpendicular to the first direction. The light-emitting diode die-bonding jig has high production efficiency and is suitable for mass production. And it is compatible with circuit boards of various thicknesses, which meets the needs of users. It also has the advantages of simple operation, reliable positioning, high production efficiency, and convenient installation and maintenance.

Description

technical field [0001] The invention relates to the field of automobile light-emitting diode manufacturing, in particular to a light-emitting diode solid crystal fixture. Background technique [0002] Light-emitting diode light sources are widely used in various fields, such as the field of automobile manufacturing, due to their advantages of small size, long life and energy saving. As a result, the demand for light-emitting diodes has increased significantly. At present, a method of fixedly connecting multiple LED arrays to a circuit board is usually used to drive the LEDs to emit light. [0003] The process of fixing light-emitting diodes on circuit boards is called die bonding. The current die-bonding fixtures are basically manual, and the circuit boards to be bonded are frequently manually installed in the die-bonding fixture. Although the cost is low, it takes a long time and is inefficient. It is only suitable for small batch trial production. Unable to meet mass pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/67
Inventor 张志辉何志宇孙永
Owner CHERY AUTOMOBILE CO LTD