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Vacuum high-temperature defoaming method and device for casted polyamide acid resin liquid film

A technology of polyamic acid resin and defoaming device, which is applied in the vacuum high-temperature defoaming field of polyamic acid resin salivating liquid film, can solve the problems such as the effective defoaming method and device of polyamic acid resin salivating liquid film, and achieve The defoaming process is easy to operate, the color is uniform, and the effect of preventing disproportionation

Active Publication Date: 2014-12-10
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] There is no effective defoaming method and device for polyamic acid resin salivation film at present

Method used

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  • Vacuum high-temperature defoaming method and device for casted polyamide acid resin liquid film
  • Vacuum high-temperature defoaming method and device for casted polyamide acid resin liquid film

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Embodiment Construction

[0021] The embodiment of the vacuum high-temperature defoaming device of the polyamic acid resin salivating liquid film figure 1 As shown, the endless steel belt 4 circulates around the front drum 3 and the rear drum 7, and the lip of the extrusion die 1 faces the steel belt 4 at the highest point of the front drum 3. There is also a vacuum high-temperature box 6 between them, the vacuum high-temperature box 6 is a closed box body, a far-infrared heating tube is installed in the box, the box body has a vacuum joint, and is connected with a vacuum pump through a pipeline. The end face has a steel strip outlet, and the steel strip entrance and the steel strip exit of the vacuum high temperature box 6 are on the same level as the steel strip entrance of the drool oven 5 . The steel strip 4 carrying the polyamic acid resin liquid film obtained by salivation through the lip of the extrusion die 1 first passes through the vacuum high-temperature oven 6 and then enters the salivation...

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Abstract

The invention relates to a vacuum high-temperature defoaming method and device for a polyamide acid resin casting liquid film. The vacuum high-temperature defoaming method is characterized in that a casted polyamide acid resin liquid film is sequentially subjected to vacuum high-temperature treatment and drying treatment to form a polyamide acid film having a self-supporting property, wherein in the vacuum high-temperature treatment, the temperature is 40-166 DEG C, the negative pressure is -0.1-0MPa, and the time lasts for 0.1-3 minutes. The vacuum high-temperature defoaming device is characterized in that a closed vacuum high-temperature box is arranged between a shaping mold and a casting drying box; a heating device is mounted in the casting drying box; a box body is provided with a vacuum joint, and the vacuum joint is connected with a draught fan or a vacuum pump through a pipeline; a steel tape belt inlet and a steel belt outlet respectively formed in front and back of the vacuum high-temperature box are formed in the same horizontal plane with a steel belt inlet of the casting drying box; a steel belt carrying the casted liquid film firstly passes through the vacuum high-temperature box and then enters the casting drying box; a tag vacuum chamber is formed in back of the shaping mold and is used for smoothly bonding the liquid film to the steel belt. According to the vacuum high-temperature defoaming method, tiny bubbles are completely eliminated, so that the quality of the polyimide film is improved; the vacuum high-temperature defoaming device is simple and is convenient to operate.

Description

technical field [0001] The invention relates to a polyimide film manufacturing technology, in particular to a vacuum high-temperature defoaming method and device for a polyamic acid resin salivating liquid film. Background technique [0002] Polyimide film is a polymer material with excellent properties such as high strength, high toughness, wear resistance, high temperature resistance, and corrosion resistance. It is widely used in the electrical and electronic industries, especially in various high-end electronic products in the electronics industry. main base material. [0003] With the development trend of light, thin, short, small and high-reliability design of downstream electronic products, the polyimide film demanded by the market tends to be thinner, and the polyimide film with a thickness of ≤12.5 μm is favored to reduce The weight and volume of downstream products using polyimide film as a small substrate. Since the density of the downstream product wiring reach...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C71/00
Inventor 任小龙南洋
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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