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Parting film for green sheet production

A technology for printed circuit substrates and peeling films, which is used in manufacturing tools, synthetic resin layered products, transportation and packaging, etc., can solve the problems of poor winding, adhesion, thinning of printed circuit substrates, etc., to prevent local thickness unevenness. Effect

Active Publication Date: 2014-12-10
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the case of using the release film described in Patent Document 1, when the release film for manufacturing a printed circuit board is wound and stored to form a printed circuit board, there is a relatively rough surface shape on the back side of the release film for manufacturing a printed circuit board. It may be transferred to the printed circuit board, and the printed circuit board may be partially thinned
As a result, when a capacitor is fabricated by laminating printed circuit boards, there are cases where defects due to short circuits occur
[0007] On the other hand, if the surface roughness (average roughness) of the surface opposite to the surface provided with the release agent layer of the base material is made relatively small, the surface becomes significantly flat, and due to the The internal and external sliding becomes poor, so defects such as poor winding and sticking may occur

Method used

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  • Parting film for green sheet production
  • Parting film for green sheet production
  • Parting film for green sheet production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0116] First, prepare a biaxially stretched polyethylene terephthalate film as a substrate [thickness: 31 μm, arithmetic average roughness Ra of the first surface 0 : 29nm, the maximum protrusion height Rp of the first surface 0 : 257nm, the arithmetic mean roughness Ra of the second surface 2 : 29nm, the maximum protrusion height Rp of the second surface 2 : 257nm].

[0117] Then, 94 parts by mass of dipentaerythritol hexaacrylate [solid content 100% by mass] as the ultraviolet curable compound (A) and 1 part by mass of polyorganic Polyether-modified acryloyl group-containing polydimethylsiloxane of siloxane (B) [Big Chemical Japan Co., Ltd., trade name "BYK-3500", solid content 100% by mass], and 5 parts by mass as α-Aminoalkylphenone-based photopolymerization initiator of the photopolymerization initiator (C) [manufactured by BASF Corporation, trade name "IRGACURE907", 2-methyl-1[4-(methylthio)phenyl]- 2-morpholinopropan-1-one, solid content 100% by mass] to obtain a rele...

Embodiment 2

[0120] In addition to changing the base material to a biaxially stretched polyethylene terephthalate film [thickness: 31 μm, arithmetic mean roughness Ra of the first surface 0 : 15nm, the maximum protrusion height Rp of the first surface 0 : 98nm, the arithmetic mean roughness Ra of the second surface 2 : 15nm, the maximum protrusion height Rp of the second surface 2 : 98 nm], a release film for printed circuit board manufacture was prepared in the same manner as in Example 1 above.

Embodiment 3

[0122] In addition to changing the base material to a biaxially stretched polyethylene terephthalate film [thickness: 38 μm, arithmetic mean roughness Ra of the first surface 0 : 35nm, the maximum protrusion height Rp of the first surface 0 : 471nm, the arithmetic mean roughness Ra of the second surface 2 : 35nm, the maximum protrusion height Rp of the second surface 2 : 471 nm], a release film for printed circuit board manufacture was prepared in the same manner as in Example 1 above.

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Abstract

This parting film for green sheet production is characterized by having a substrate, which has a first surface and a second surface, and a parting agent layer, which is formed on the first surface side of the substrate, the maximum protrusion height (Rp2) of the second surface of the substrate being 60-500 nm, and the area occupancy of protrusions having a height of at least 60 nm on the second surface being no greater than 10%. By means of the present invention, it is possible to suppress the occurrence of localized thickness unevenness and pinholes in the green sheet.

Description

technical field [0001] This invention relates to the peeling film for printed circuit board manufacture. Background technique [0002] In the manufacture of laminated ceramic capacitors, release films for printed circuit board manufacturing are used to form printed circuit boards. [0003] The release film for printed circuit board manufacture is generally comprised from a base material and a release agent layer. A ceramic slurry obtained by dispersing and dissolving ceramic particles and a binder resin in an organic solvent is coated on the release film for producing a printed circuit board, and the coated product is dried to produce a printed circuit board. By this method, a printed circuit board of uniform thickness can be efficiently produced. And the printed circuit board manufactured in this way was peeled from the release film for printed circuit board manufacture, and it was used for manufacture of a laminated ceramic capacitor. [0004] In manufacture of the abov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B1/30B32B27/00
CPCB32B27/00B28B1/30Y10T428/24355B28B7/364
Inventor 深谷知巳市川慎也
Owner LINTEC CORP