An apparatus performing as a base for printing 3D objects using high temperature thermoplastics employing additive manufacturing methods is provided. The apparatus comprises a heated build platform, a thin removable plate secured on top of the build platform, a high temperature polymer coating applied over the removable plate, and surface treatment of high temperature polymer coating to maintain adhesion between 3D object and printing surface. Also, the removable plate has low coefficient of thermal expansion compared to build platform below it, for avoiding bowing of the plate as it is heated due to heated build platform, hence providing flat printing surface. The thin removable plate allows 3D objects to pop off the plate upon cooling, without damaging the polymer coating, the plate, or the object. It also allows for continuous operation of printing, while the plate is released for cooling, a new plate is installed for printing.