Printed circuit board
A technology for printed circuit boards and substrates, applied in the direction of printed circuit components, etc., can solve the problems of quality and efficiency degradation, lowering resonance frequency, signal insertion loss, etc., to lower the equivalent dielectric coefficient and reduce the equivalent capacitance. value, the effect of optimizing the insertion loss
Inactive Publication Date: 2014-12-17
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
As the stub becomes longer, the equivalent capacitance becomes larger, lowering the resonant frequency, which reduces the quality and efficiency of the PCB when transmitting high-frequency signals, which results in loss of signal insertion
[0003] Usually, the industry will use back drilling in the post-production process of the PCB to remove the excess length of the stub to achieve the effect of connecting to a high resonance frequency, but this will increase the manufacturing cost of the printed circuit board at the same time
Method used
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Embodiment Construction
[0013] see figure 1 and figure 2 As shown, a printed circuit board 100 according to an embodiment of the present invention includes a substrate 10, a first signal via hole 20 and a second signal via hole 30 opened on the substrate 10, and a hole extended from the first signal via hole 20. The first differential signal transmission line 40, the second differential signal transmission line 50 extending from the second signal via hole 30, the first ground via hole 60 opened on the substrate 10 close to the first signal via hole 20, the substrate 10 The second ground via hole 70 opened close to the second signal via hole 30, the first through hole 80 opened between the first signal via hole 20 and the first ground via hole 60 on the substrate 10, and the second ground via hole 80 on the substrate 10. The second through hole 90 is opened between the second signal via hole 30 and the second ground via hole 70 .
[0014] In this embodiment, the first signal via hole 20, the second...
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A printed circuit board comprises a substrate, a first signal through hole, a second signal through hole, a first ground through hole, a second ground through hole, a first penetrating hole and a second penetrating hole, wherein the first signal through hole and the second signal through hole are formed in the substrate; the first ground through hole is formed in the substrate and is close to the first signal through hole; the second ground through hole is formed in the substrate and is close to the second signal through hole; the first penetrating hole is formed in the substrate and between the first signal through hole and the first ground through hole; and the second penetrating hole is formed in the substrate and between the second signal through hole and the second ground through hole. Compared with the prior art, the printed circuit board has the advantages that the first penetrating hole is formed between the first signal through hole and the first ground through hole, the second penetrating hole is formed between the second signal through hole and the second ground through hole, the equivalent dielectric coefficient of a capacitor can be reduced, the equivalent capacitance is reduced effectively, the resonance frequency is increased, and insertion loss is optimized. By the printed circuit board, redundant stored piles are not required to be removed in a backdrill mode.
Description
technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board with a ground via hole. Background technique [0002] At present, in the design of the printed circuit board (PCB) of the high-speed backplane, due to the large number of transmission signals and the printed circuit board has a certain thickness. When the high-speed signal is transmitted on the PCB through the high-speed backplane connector, a certain length of stub will be left in the signal via hole on the upper layer. In this way, a resonant frequency of a certain wavelength is formed in the printed circuit board, which is determined by the stub. Composed of equivalent inductance and capacitance caused by piles. The signal via and the ground via can be regarded as an equivalent capacitive structure. As the stub becomes longer, the equivalent capacitance becomes larger, lowering the resonant frequency, which reduces the quality and efficiency of the PCB when ...
Claims
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IPC IPC(8): H05K1/02
Inventor 蔡文杰林芳怡
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD