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Chip inductor and method of manufacturing same

An inductor and chip technology, which is applied in the field of chip inductors and the manufacture of the chip inductors, can solve the problems of defective products, external electrodes and coil electrical connectivity deterioration, etc.

Active Publication Date: 2017-05-31
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Such an insulating film may deteriorate the electrical connectivity of external electrodes and coils, resulting in defective products

Method used

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  • Chip inductor and method of manufacturing same
  • Chip inductor and method of manufacturing same
  • Chip inductor and method of manufacturing same

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Embodiment Construction

[0035] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0036] This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0037] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0038] figure 1 is a perspective view showing a chip inductor according to an exemplary embodiment of the present disclosure, figure 2 yes figure 1 cross-sectional view of , and image 3 is showing figure 1 A perspective view of the coil portion of a chip inductor.

[0039] refer to Figure 1 to Figure 3 , according to an ...

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PUM

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Abstract

The invention provides a chip inductor and a method for manufacturing the same. The chip inductor comprises an inductor main body and a wire coil part, wherein the inductor main body is formed by a metal compound, and the wire coil part is arranged in the inductor main body and is provided with two end parts that are separated from each other after being exposed out from the inductor main body.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2013-0086099 filed with the Korean Intellectual Property Office on Jul. 22, 2013, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip inductor and a method of manufacturing the chip inductor. Background technique [0003] Recently, according to remarkable development of electronic and communication devices, problems such as communication errors due to mutual interference caused by frequent use of electronic and communication devices have frequently occurred. [0004] Therefore, in order to improve the electromagnetic environment, which is easily deteriorated due to the use of wireless communication devices and multimedia devices, various countries have strengthened regulations on electromagnetic interference. [0005] According to this trend, recently, the development of electromagnetic interference removing devices has bee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/00H01F37/00H01F27/28H01F27/24H01F1/12H01F41/00
CPCH01F10/30H01F17/0013H01F27/292H01F41/02
Inventor 金在光申祥皓曹秉局许勋奭
Owner SAMSUNG ELECTRO MECHANICS CO LTD