Camera module

A technology for camera modules and packaging substrates, which is applied to TVs, color TV parts, electrical components, etc., and can solve the problem of tilting the optical axis of the lens, shortening the distance between the lens and the image sensor, and affecting the image quality of the camera module and other issues to achieve the effect of ensuring the image quality and avoiding changes in relative positions

Active Publication Date: 2015-02-04
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the use of the camera module assembly machine, the colloid is often deformed by various heat and forces, resulting in changes in the relative position between the lens and the image sensor, for example: the lens and the image sensor The distance of the sensor is shortened or the optical axis of the lens is tilted, etc.
These problems will seriously affect the imaging quality of the camera module

Method used

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Embodiment Construction

[0014] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. see figure 1 and figure 2 , The camera module 100 provided by the embodiment of the present invention includes a circuit board 10 , an image sensor 20 , a package substrate 30 , a filter 40 , a mirror holder 50 and a lens 60 . In this embodiment, the circuit board 10 is a flexible circuit board.

[0015] The packaging substrate 30 is in the shape of a square frame, and is electrically connected to the circuit board 10 for packaging the image sensor 20 on the circuit board 10 . Specifically, the packaging substrate 30 includes a first surface 310 facing the image sensor 20 and a second surface 320 facing away from the first surface 310 . The first surface 310 defines a receiving groove 311 for receiving the image sensor 20 . An opening 330 penetrating through the first surface 310 and the second surface 320 is opened in the center of the ...

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Abstract

The present invention provides a camera module including an image sensor, a package substrate for packaging the image sensor, a lens seat covering the image sensor, and a lens provided on the lens seat. The lower end portion of the lens seat away from the lens includes a dispensing face facing the package substrate and a plurality of bumps protruding toward the package substrate from the dispensing face, the dispensing face is adhered to the package substrate by gel, and the bumps directly touch the package substrate. The gel on the dispensing face does not deform due to effects of various heat and force, avoiding change of relative position between the lens and the image sensor, and ensuring imaging quality of the camera module.

Description

technical field [0001] The invention relates to a camera module. Background technique [0002] Existing camera modules generally include a circuit board, an image sensor disposed on the circuit board, a lens mount covering the image sensor, and a lens disposed on the mirror mount. The bottom of the mirror base is generally bonded to the circuit board by colloid. However, during the use of the camera module assembly machine, the colloid is often deformed by various heat and forces, resulting in changes in the relative position between the lens and the image sensor, for example: the lens and the image sensor The distance of the sensor becomes shorter or the optical axis of the lens is tilted, etc. These problems will seriously affect the imaging quality of the camera module. Contents of the invention [0003] In view of this, it is necessary to provide a camera module capable of ensuring image quality. [0004] A camera module, which includes an image sensor, a packaging...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 陈信文
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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