Electrically conductive paste and base material with electrically conductive film

A technology of conductivity and paste, which is applied in the field of substrates with conductive films, can solve problems such as high cost, deterioration of conductivity, and damage of conductivity, and achieves suppression of deterioration of conductivity, excellent conductivity, and high conductivity Effect

Active Publication Date: 2015-03-18
UNKNOWN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, the conductive paste described in Patent Document 2 has a problem of high cost due to the complicated process of thinly coating nickel on the surface of metal particles by electroless plating.
As a result, there is oxidized nickel on the surface of the metal particles, and there is a problem that the conductivity is impaired.
In addition, the conductive paste described in Patent Document 3 has a problem that conductivity is deteriorated by 20% compared to the case of only silver particles due to the addition of nickel particles with a large particle size to silver particles with low resistivity to inhibit conduction. ~65% or so

Method used

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  • Electrically conductive paste and base material with electrically conductive film

Examples

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Embodiment

[0076] Hereinafter, the present invention will be described in further detail through examples, but the present invention is not limited to these examples. Examples 1 to 8 are examples, and examples 9 to 13 are comparative examples. In addition, the average particle diameter of metal particle (copper particle) and base metal particle (nickel particle), the thickness of a conductive film, and resistivity were measured using the apparatus shown below, respectively.

[0077] (The average particle size)

[0078] Copper particles were used as metal particles. The particle size of the copper particles is calculated as follows: The Feret diameter of 100 particles randomly selected from the SEM image obtained by SEM (manufactured by HITACHI HIGH-TECHNOLOGIES CORPORATION, S-4300) is measured, and the Feret diameter of each copper particle is calculated. When the radial direction with the maximum diameter is set as the major axis, and the axis perpendicular to the major axis is set as...

example 1

[0084] After adding 3.0 g of formic acid and 9.0 g of a 50% by mass hypophosphorous acid aqueous solution to a glass beaker, the beaker was placed in a water bath and maintained at 40°C. 5.0 g of copper particles (manufactured by Mitsui Metal Mining Co., Ltd., trade name: 1400YP) were gradually added to the beaker with an average particle size of 6 μm, and stirred for 30 minutes to obtain a copper dispersion.

[0085] Using a centrifugal separator, centrifugation was performed at a rotation speed of 3000 rpm for 10 minutes, and the precipitate was recovered from the obtained copper dispersion liquid. This precipitate was dispersed in 30 g of distilled water, and the aggregate was precipitated again by centrifugation to separate the precipitate. Thereafter, the obtained precipitate was heated at 80° C. for 60 minutes under a reduced pressure of -35 kPa to volatilize and slowly remove residual water, thereby obtaining copper particles (A) whose particle surfaces were surface-mod...

example 2

[0089] The same procedure as Example 1 was performed except that the copper particles were changed to copper particles with an average particle size of 7 μm (manufactured by NIPPON ATOMIZED METAL POWDERS CORPORATION, trade name: AFS-Cu), and the nickel powder was changed to an average particle size of 0.5 μm. A copper paste is obtained. The value of the average particle diameter of the nickel powder (particle) of (B) component / the average particle diameter of the copper particle of (A) component was 0.07.

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Abstract

The invention provides electrically conductive paste with excellent electrically conductivity and durability, and a base material which is formed by use of the electrically conductive paste and provided with an electrically conductive film. The electrically conductive paste is characterized in that the electrically conductive paste comprises (A) metal particles whose volume resistivity is less than 10 [mu]omega cm and average diameter is 1-15 [mu]m; (B) base metal particles whose average parameter is 0.1-3 [mu]m and oxidation reduction potential is -440 mV-320 mV (SHE); and (C) binder resin. 0.01-3 parts by mass of above (B) base metal particles are contained relative to 100 parts by mass of above (A) metal particles.

Description

technical field [0001] The present invention relates to a conductive paste and a substrate with a conductive film using the same. Background technique [0002] Conventionally, in the formation of wiring conductors such as electronic components and printed wiring boards, a method of using a conductive paste containing highly conductive metal particles is known. Among them, the production of a printed wiring board is performed by applying a conductive paste to a desired pattern shape on an insulating base material and curing it to form a conductive film that becomes a wiring pattern. [0003] The conductive paste used for the above purpose should have the following characteristics: (1) good electrical conductivity, (2) easy to carry out screen printing and gravure printing, (3) good adhesion between the coating film and the insulating substrate, (4) Thin line circuits and the like can be formed. [0004] In order to satisfy the above-mentioned characteristics, the conductive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B5/14
CPCH01B1/22H01B5/14H05K1/092
Inventor 平社英之米田贵重柏田阳平
Owner UNKNOWN
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