Light-emitting diode packaging structure and manufacturing method thereof

A technology of light-emitting diodes and packaging structures, which is applied to electrical components, electrical solid devices, circuits, etc., can solve problems such as side light leakage, and achieve the effect of preventing side light leakage

Active Publication Date: 2017-08-29
BRIGHTEK (SHENZHEN) OPTOELECTRONIC CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the light emitted by the known light source still produces side light leakage from the side of the prefabricated metal cover

Method used

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  • Light-emitting diode packaging structure and manufacturing method thereof
  • Light-emitting diode packaging structure and manufacturing method thereof
  • Light-emitting diode packaging structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example 〕

[0030] see Figure 1 to Figure 4 As shown, the first embodiment of the present invention provides a method for manufacturing a light emitting diode (LED) packaging structure Z for preventing side light leakage. Such as figure 1 Shown flow process step, it comprises the following steps:

[0031] Step S100: Matching figure 2 As shown, a plurality of light emitting units 2 are disposed on a carrier substrate 1', wherein the plurality of light emitting units 2 are electrically connected to the carrier substrate 1'. For example, each light emitting unit 2 includes at least one light emitting diode chip 20, and the light emitting diode chip 20 can be electrically connected to the carrier substrate 1' through two wires (not labeled);

[0032] Step S102: Matching figure 2 As shown, a plurality of light-transmitting colloids 30 are formed on the carrier substrate 1' and respectively cover a plurality of light-emitting units 2, which may be transparent colloids, colloids with fluo...

no. 2 example

[0037] see Figure 5 to Figure 6 As shown, the second embodiment of the present invention provides another manufacturing method of a light emitting diode (LED) packaging structure Z for preventing side light leakage. Wherein, step S200, steps S206-S208 of this embodiment are the same as step S100, steps S104-S106 of the above-mentioned embodiment respectively, so no more details are given here. The biggest difference between this embodiment and the above-mentioned embodiment is the following steps:

[0038] Step S202: cooperation Image 6 As shown, a light-transmitting glue 30 disposed on the carrier substrate 1' and covering a plurality of light-emitting units 2 is formed. Furthermore, the transparent colloid 30 can be a transparent colloid, a colloid with fluorescent particles or a colloid with diffusion particles, and the transparent colloid 30 has an 20 of the first light-transmitting portion 30A and at least one second light-transmitting portion 30B protruding upward f...

no. 3 example

[0041] see Figure 7 As shown, the third embodiment of the present invention can provide a light emitting diode packaging structure Z for preventing side light leakage, which includes: a substrate unit 1 , a light emitting unit 2 , a light transmitting unit 3 and a light shielding unit 4 . Depend on Figure 7 and Figure 4 The comparison shows that the biggest difference between this embodiment and the above-mentioned embodiment is that the light-transmitting unit 3 further includes a plurality of fluorescent particles 31 evenly distributed in the light-transmitting colloid 30 and a plurality of diffusion particles evenly distributed in the light-transmitting colloid 30. Particles 32, wherein a plurality of diffusing particles 32 can be used to increase the light extraction efficiency of the present invention. In other words, the light-transmitting unit 3 can be formed by mixing the light-transmitting colloid 30 , a plurality of fluorescent particles 31 , and a plurality of ...

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PUM

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Abstract

The invention discloses a light-emitting diode packaging structure and a manufacturing method of the light-emitting diode packaging structure. The light-emitting diode packaging structure comprises a substrate unit, a light-emitting unit, a light-transmitting unit and a shading unit. The substrate unit comprises a circuit substrate. The light-emitting unit comprises at least one a light-emitting diode chip which is arranged on the circuit substrate and electrically connected to the circuit substrate. The light-transmitting unit comprises a light-transmitting rubber body which is arranged on the circuit substrate and wraps the light-emitting diode chip. The light-transmitting rubber body is provided with a first light-transmitting part which is arranged on the circuit substrate and wraps the light-emitting diode chip and at least one second light-transmitting part which protrudes upwards from the first light-transmitting part and corresponds to the light-emitting diode chip, and the second light-transmitting part is provided with a light emergency surface. The shading unit comprises a shading rubber body, wherein the shading rubber body is arranged on the circuit substrate, the light emergency surface of the second light-transmitting part is exposed through the shading rubber body, and the shading rubber body is provided with an upper surface flush with the light emergency surface of the second light-transmitting part.

Description

technical field [0001] The invention relates to a light-emitting diode packaging structure and a manufacturing method thereof, in particular to a light-emitting diode packaging structure for preventing side light leakage and a manufacturing method thereof. Background technique [0002] In recent years, due to the rapid development of the information industry, users may use portable electronic devices, such as notebook computers or smart phones, in different environments. For notebook computers, in a low-light environment, users may not be able to clearly see the numbers and characters marked on the keyboard keys, resulting in difficulty in operation, and in severe cases, the user's vision may be impaired due to the difficulty in recognizing the key marks. damage. In the prior art, adding an indicator light on a specific key can improve the above problems. In addition, through the different lighting configurations of the indicator lights, the user of the keyboard can know w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/54H01L33/48
CPCH01L24/97H01L2224/48091H01L2924/12041
Inventor 黄建中吴志明黄同伯
Owner BRIGHTEK (SHENZHEN) OPTOELECTRONIC CO LTD
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