The present invention discloses a stacked chip encapsulation structure, a chip encapsulation structure and the making process therein, which includes a first encapsulation structure unit and a second encapsulation structure unit. Wherein, the first encapsulation structure unit has a loader, a chip, a first sealant, a wire distribution element, a conductive element; and a second sealant covers the loader surface, the chip, the first sealant, the wire distribution element and the conductive element and are exposed out of the top of the conductive element; moreover, the second encapsulation structure unit realizes electric connection with the wire distribution element through the conductive element. By using a wire distribution element connecting two encapsulation structure units, the present inventionsaves the useable space of the loader and improves the integration degree; moreover, as the sealant covers the whole loading surface, the figure is not influenced by the size and configuration of the chip, therefore, the sealant mould of the making process of the invention can have various chip sizes and configurations.