Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic equipment

An electronic device, the first technology, applied in the electronic field, can solve problems such as poor heat dissipation, achieve the effect of reducing relative thickness, saving available space, and enriching heat dissipation methods

Active Publication Date: 2016-01-06
LENOVO (BEIJING) CO LTD
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] An embodiment of the present invention provides an electronic device, which is used to solve the technical problem of poor heat dissipation effect of the electronic device in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic equipment
  • Electronic equipment
  • Electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to solve the technical problem of poor heat dissipation effect of electronic equipment in the prior art, an embodiment of the present invention provides an electronic equipment, the main structure of which includes:

[0030] first heat source 101;

[0031] The second heat source 102; wherein, the heat generated by the first heat source 101 is greater than the heat generated by the second heat source 102;

[0032] The first heat dissipation component 103, the first region of which is in contact with the first heat source 101, for conducting the heat of the first heat source 101 to the first heat dissipation component 103;

[0033] The second heat dissipation component 104 is used for conducting the heat of the second heat source 102 to the second heat dissipation component 104 ; wherein, the thermal conductivity of the first heat dissipation component 103 is better than that of the second heat dissipation component 104 .

[0034] The main technical effects or a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses electronic equipment, and aims at solving the technical problem that the heat radiation performance of electronic equipment is low. The electronic equipment comprises a first heat source, a second heat source, a first heat radiation assembly and a second heat radiation assembly, wherein heat generated by the first heat source is greater than that generated by the second heat source, a first area of the first heat radiation assembly makes contact with the first heat source to transfer heat of the first heat source to the first heat radiation assembly, heat of the second heat source is transferred to the second heat radiation assembly, and the thermal conductivity of the first heat radiation assembly is higher than that of the second heat radiation assembly.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device. Background technique [0002] At present, electronic devices are becoming smaller and more functional, such as tablet computers, smart watches, etc. As the functions of electronic devices become more abundant, the heat generated by each component of the corresponding electronic devices is also increasing , the heat dissipation problem of electronic equipment needs to be solved urgently. [0003] In the prior art, heat dissipation is often only aimed at the components that generate the highest heat in electronic equipment, that is, the Central Processing Unit (CPU), and because the central processing unit (CPU) generates too much heat when running a large number of instructions, the heat dissipation effect of a single material Not good. At the same time, other components inside the electronic device will also generate a lot of heat, resulting in uneven h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K7/20
Inventor 甄庆娟
Owner LENOVO (BEIJING) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products