Electronic equipment

An electronic device, the first technology, applied in the electronic field, can solve problems such as poor heat dissipation, achieve the effect of reducing relative thickness, saving available space, and enriching heat dissipation methods

Active Publication Date: 2016-01-06
LENOVO (BEIJING) CO LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] An embodiment of the present invention provides an electronic device, which is used to sol

Method used

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Embodiment Construction

[0029] In order to solve the technical problem of poor heat dissipation effect of electronic equipment in the prior art, an embodiment of the present invention provides an electronic equipment, the main structure of which includes:

[0030] first heat source 101;

[0031] The second heat source 102; wherein, the heat generated by the first heat source 101 is greater than the heat generated by the second heat source 102;

[0032] The first heat dissipation component 103, the first region of which is in contact with the first heat source 101, for conducting the heat of the first heat source 101 to the first heat dissipation component 103;

[0033] The second heat dissipation component 104 is used for conducting the heat of the second heat source 102 to the second heat dissipation component 104 ; wherein, the thermal conductivity of the first heat dissipation component 103 is better than that of the second heat dissipation component 104 .

[0034] The main technical effects or a...

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Abstract

The invention discloses electronic equipment, and aims at solving the technical problem that the heat radiation performance of electronic equipment is low. The electronic equipment comprises a first heat source, a second heat source, a first heat radiation assembly and a second heat radiation assembly, wherein heat generated by the first heat source is greater than that generated by the second heat source, a first area of the first heat radiation assembly makes contact with the first heat source to transfer heat of the first heat source to the first heat radiation assembly, heat of the second heat source is transferred to the second heat radiation assembly, and the thermal conductivity of the first heat radiation assembly is higher than that of the second heat radiation assembly.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device. Background technique [0002] At present, electronic devices are becoming smaller and more functional, such as tablet computers, smart watches, etc. As the functions of electronic devices become more abundant, the heat generated by each component of the corresponding electronic devices is also increasing , the heat dissipation problem of electronic equipment needs to be solved urgently. [0003] In the prior art, heat dissipation is often only aimed at the components that generate the highest heat in electronic equipment, that is, the Central Processing Unit (CPU), and because the central processing unit (CPU) generates too much heat when running a large number of instructions, the heat dissipation effect of a single material Not good. At the same time, other components inside the electronic device will also generate a lot of heat, resulting in uneven h...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 甄庆娟
Owner LENOVO (BEIJING) CO LTD
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